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UL 16L Rfid Printed Circuit Board Fabrication Immersion Gold

Categories Multilayer PCBs
Brand Name: IBE
Model Number: multilayer pcb
Certification: ISO/TS16949 ISO13485
Place of Origin: China
MOQ: 10
Price: $0.1-$0.5
Payment Terms: D/A, L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability: 50000pcs/week
Delivery Time: 5-8 working days
Packaging Details: Vacuum Package
Surface finishing: ENIG
Copper thickness: 1oz
Base material: FR4
Min. line spacing: 0.075mm
Board thickness: 1.6mm
Min. hole size: 0.25mm
soldermask color: green
silkscreen color: white
layer: 1-32L
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UL 16L Rfid Printed Circuit Board Fabrication Immersion Gold

China multilayer pcb manufacturing pcb fabrication 16L RFID PCB with UL approval

PCBA Capability

PCB Manufacturing Capability
PCB Layers:1Layers to 18 layer (Max)
Board thickness:0.13~6.0mm
Min line width/space:3mil
Min mechanical hole size:4mil
Copper thickness:9um~210um(0.25oz~6oz)
Max aspect ratio:1:10
Max board size:400*700mm
Surface Finish:HASL, immersion gold, immersion silver,immersion tin, flash gold, gold finger,peelable mask
Material:FR4,High Tg, Rogers, CEM-1, CEM-3, Aluminum BT, PTFE.
PCB Assembly Capability
Stencil size range:1560*450mm
Min SMT package:0402/1005(1.0x0.5mm)
Min IC pitch:0.3mm
Max PCB Size:1200*400mm
Min PCB thickness:0.35mm
Min Chip Size:01005
Max BGA Size:74*74mm
BGA Ball Pitch:1.00~3.00mm
BGA Ball Diameter:0.4~1.0mm
QFP Lead Pitch:0.38~2.54mm
Testing :ICT,AOI,X-RAY,Funtional test etc.

Delivery Time:
Order Conditions
Standard Delivery Date
The fastest Delivery Date
Prototype ( <20pcs)
2days
8hours
Small Volume (20-100pcs)
6days
12hours
Medium Volume (100-1000)
3days
24hours
Mass Production (>1000)
Depends on BOM
Depends on BOM

Quality UL 16L Rfid Printed Circuit Board Fabrication Immersion Gold for sale
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