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2.0mm pitch SPH-002T wire to board connector tin-plated phosphor crimp terminals

Categories	Wire Connector Terminals
Brand Name:	HRT
Model Number:	A2001-T
Certification:	ISO9001/ ISO14001/UL/RoHS/REACH
Place of Origin:	dongguan, China(mainland)
MOQ:	100K PCS
Price:	Negotiated
Payment Terms:	TT, Western Union, PayPal, L/C
Supply Ability:	100 million pcs per month
Delivery Time:	5 to 8 working days after payment checked
Packaging Details:	paper tray with out carton
Pitch:	2.0mm
wire range:	AWG#26 - #30
Material:	Phosphor
Finish:	Tin-plated or Gold-flash
Category:	Terminal
Insulation O.D:	1.30mm(Max)

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Company Info.

RULETEAM CONNECTION TECHNOLOGY (SHENZHEN) CO.,LTD

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Product Details
Company Profile

2.0mm pitch SPH-002T wire to board connector tin-plated phosphor crimp terminals

1, The specification of the product including basic size information, electrical and mechanical properties.

Basic size information
Termination Interface Style		Crimp or compression
Processing methods		E-stamping before tin-plated or Gold-flash
Insulation O.D.		1.30mm(Max)
Part No.		A2001-TPE or A2001-GPE
Application		Signal, PCB borad

Electrical properties
Current Rating		2A AC, DC
Voltage Rating		100V AC, DC
Contact Resistance		10mΩ Max
Insulation Resistance		1000MΩ min
Withstanding Voltage		800V AC/minute

Mechanical properties
Temperature range		-25℃ to 85 ℃
Other information please kindly check the following picture.

2 Mated Hosuing information

Product Profile

Series	Wire connector A2001H-NP & A2001HB-NP
Category	Wire to Board Crimp style Connectors
Type	Disconnectable type Crimp style, Thin type

Specification

Pitch	2.0 mm
Current rating	2A AC,DC(AWG#26 to #30)
Voltage rating	100V AC, DC
PC board mounting direction	Top entry, Side entry

3, Related drawing and report

The following pictures are engineering drawing and testing report for your reference, wish these can help you to purchase the ideal and right parts from us. Thank you!

Testing report

1. Scope

This specification covers the requirements for product performance of 2.00mm pitch wire to board

connectors series.

2. Construction,Dimensions,Material & Plating

See the attached drawings

3. Ratings & Applicable Wires

Item	Standard
Rated Voltage (Max.)	100V AC/DC		Insulation O.D. 1.50mm (Max.)
Rated Current (Max.) And Applicable Wires	AWG#24	2.0A AC/DC
	AWG#26	1.5A AC/DC
	AWG#28	1.0A AC/DC
	AWG#30	0.5A AC/DC
Ambient Temperature Range	-25℃ ~ +85℃*

*: Including terminal temperature rise

4. Electrical Performance

Test Description		Procedure	Requirement
4-1	Contact Resistance	Mate connectors, measure by dry circuit, 20mV max., 10mA.(Based upon JIS C5402 5.4)	10mΩ (Max.)
4-2	Insulation Resistance	Mate connectors, apply 500V DC between adjacent terminal or ground. (Based upon JIS C5402 5.2/MIL-STD-202 Method 302 Cond. B)	1000MΩ (Min.)
4-3	Dielectric Withstanding Voltage	Mate connectors, apply 800V AC (rms) for 1 minute between adjacent terminal or ground. (Based upon JIS C5402 5.1/MIL-STD-202 Method 301)	No Breakdown.
4-4	Contact Resistance on Crimped Portion	Crimp the applicable wire on to the terminal, measure by dry circuit, 20mV (Max.)., 10mA.	5mΩ (Max.)

5. Mechanical Performance

Test Description		Procedure	Requirement
5-1	Actuator Insertion & Withdrawal Force	Insert and withdraw connectors at the speed rate of 25±3mm / minute.	Refer to paragraph 7-2
5-2	Crimping Pull Out Force	Fix the crimped terminal, apply axial pull out force on the wire at the speed rat of 25±3mm / minute.(Based upon JIS C5402 6.8)	AWG#24	3.0kgf (Min)
			AWG#26	2.0kgf (Min)
			AWG#28	1.0kgf (Min)
			AWG#30	0.8kgf (Min)
5-3	Terminal Insertion Force.	Insert the crimped terminal into the housing.	1.00kgf (Max.)
5-4	Terminal/Housing Retention Force.	Apply axial pull out force at the speed rate of 25±3mm / minute on the terminal assembled in the housing.	1.50kgf (Min.)
5-5	Pin Retention Force	Apply axial push force at the speed rate of 25±3mm / minute	1.00kgf (Min.)
5-6	Latch Yield Strength	Mate connectors and pull apart until both latches break at the speed rate of 25±3mm / minute	3.00kgf (Min.)
5-7	Durability	When mated up to 50 cycles repeatedly by the rate of 10 cycle per minute.	Contact Resistance 20mΩ (Max.)
5-8	Vibration	Amplitude: 1.5mm P-P Sweep time: 10-55-10 Hz in 1 minute Duration: 2 hours in each X.Y.Z. axes. (Based upon MIL-STD-202 Method 201A)	Appearance No Damage. Contact Resistance 20mΩ (Max.) Discontinuity 1 μsec.(Max.)
5-9	Physical Shock	490m/s²｛50G｝,3 strokes in each X.Y.Z. axes. (Based upon JIS C0041/MIL-STD-202 Method 213B Cond. A)

6. Environmental Performance And Others

Test Description		Procedure	Requirement
6-1	Temperature Rise	Carrying rated current load.(Based upon UL 498)	30℃(Max.)
6-2	Heat Resistance	85±2℃,96 hours (Based upon JIS C0021/MIL-STD-202 Method 108A Cond. A)	Appearance No Damage. Contact Resistance 20mΩ (Max.)
6-3	Cold Resistance	-25±3℃,96 hours (Based upon JIS C0020)	Appearance No Damage. Contact Resistance 20mΩ (Max.)
6-4	Humidity	Temperature: 40±2℃ Relative Humidity : 90~95% Duration: 96 hours (Based upon JIS C0022/MIL-STD-202 Method 103B Cond. B)	Appearance No Damage. Contact Resistance 20mΩ (Max.) Insulation Resistance 100MΩ (Min.) Dielectric Withstanding Voltage Must meet 4-3
6-5	Temperature Cycling	5 cycles of: a) -55℃ 30 minutes b) +85℃ 30 minutes (Based upon JIS C0025)	Appearance No Damage. Contact Resistance 20mΩ (Max.)
6-6	Salt Spray	Tin-plated 12 hours / Gold- plated 24 hours exposure to a salt spray from the 5±1% solution at 35±2℃. (Based upon JIS C0023/MIL-STD-202 Method 101D Cond. B)
6-7	SO2 Gas	24 hours exposure to 50±5ppm. SO2 gas at 40±2℃.
6-8	NH3 Gas	40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution.
6-9	Solderability	Soldering Time: 5±0.5 sec. Solder Temperature: 245±5℃	Solder Wetting 95% of immersed area must show no voids, pin holes

6-10

Resistance to Soldering Heat

(DIP)

Solder pot method

Soldering time: 10±0.5 sec.

Solder Temperature: 260±5℃

Solder iron method

Soldering Time: 5±0.5 sec.

Solder Temperature: 370℃ ~ 400℃

Appearance No Damage.

6-11

Resistance to Soldering Heat (SMT)

When reflowing

Refer to paragraph 8

Solder iron method

Soldering Time: 5±0.5 sec.

Solder Temperature: 370℃ ~ 400℃

Appearance No Damage.

7. Crimp Specifications & Actuator Insertion/Withdrawal Force

7-1 Terminals with height, suggestion pressure width and wire and terminal's retention

Wire Diameter	Numbers	Conductor Parts(Core Wire)mm		Insulation Parts(PVC)mm
		Width	Height	Width	Height
AWG#24	A2001	1.20±0.10	0.75±0.05	1.60(Max.)	2.00(Max.)REF.
AWG#26			0.70±0.05
AWG#28			0.65±0.05
AWG#30			0.60±0.05

7-2 WITHOUT A LOCK [Unit : kgf]

Circuits	At Initial		Circuits	At Initial
Circuits	Insertion (Max.)	Withdrawal (Min.)	Circuits	Insertion (Max.)	Withdrawal (Min.)
Single	0.70	0.10	10	5.00	1.70
02	1.00	0.50	11	5.50	1.70
03	1.50	0.65	12	6.00	1.85
04	2.00	0.80	13	6.00	2.00
05	2.50	0.95	14	6.00	2.00
06	3.00	1.10	15	6.00	2.00
07	3.50	1.25	16	6.00	2.15
08	4.00	1.40	17	6.00	2.15
09	4.50	1.55	18	6.00	2.15

7-3 LOCK [Unit : kgf]

Circuits	At Initial		Circuits	At Initial
Circuits	Insertion (Max.)	Withdrawal (Min.)	Circuits	Insertion (Max.)	Withdrawal (Min.)
03	2.50	3.00	10	6.00	4.50
04	3.00	3.00	11	6.50	4.50
05	3.50	3.00	12	7.00	4.50
06	4.00	3.00	13	7.50	5.00
07	4.50	3.50	14	8.00	5.00
08	5.00	4.00	15	8.00	5.00
09	5.50	4.00	16	8.00	5.50

Product Tags:

Crimp Terminal Connector

Crimp Wire Connectors

2.0mm pitch SPH-002T wire to board connector tin-plated phosphor crimp terminals

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