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30W 36V Residencial Chip LED Cob Commerical Light High Power Indoor Bridgelux RA90

Categories Chip LED Cob
Brand Name: TYF
Model Number: M36-02L
Certification: CE,RoHs
Place of Origin: Shenzhen
MOQ: Negotiation
Price: Negotiable
Payment Terms: D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability: 1,000,000 PCS/day
Delivery Time: 5-7 days
Power: 30w
Chip material: Bridgelux
Type: COB LED
Application: COB LED grow lamp,led flood
Lifespan: 50000hours
Name: Commercial Chip Led Cob
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30W 36V Residencial Chip LED Cob Commerical Light High Power Indoor Bridgelux RA90

30W 36V Residencial Commerical Light High Power Indoor LED Chips COB LED Bridgelux RA90


• Efficacy of 155 lm/W typical for 3000K, 80CRI

• Compact high flux density light source

• Uniform, high quality illumination

• Minimum 70, 80, and 90 CRI options

• StreaCLined thermal path

• ENERGY STAR® / ANSI compliant color binning

structure with 2, 3 and 5 SDCM standard


Features Of High Power Cob LED

1. Good thermal performance and wide hot channel.

2. The spot is uniform.

3. Energy saving and environmental protection, high light efficiency.

4. High brightness, low light decay, polished.

5. Easy to use and easy to install.

6. Strong antistatic ability.



The part number designation for TYF ML Series LED arrays is explained as follows:




Part Number

Typical Power (W)Nominal CCT (K)

CRI

Minimum Pulsed Flux (lm)Typical Pulsed Flux (lm)Typical Voltage (V)Nominal Current (mA)Typical Efficacy (lm/W)
CL25171210P430E*730.63000 K704468480434900157
CL25171210P435E*730.63500 K704553489634900160
CL25171210P440E*730.64000 K704639498834900163
CL25171210P450E*730.65000 K704696504934900165
CL25171210P457E*730.65700 K704724508034900166
CL25171210P465E*730.66500 K704696504934900165
CL25171210P422E*830.62200 K803785407034900133
CL25171210P427E*830.62700 K804013431534900141
CL25171210P430E*830.63000 K804183449834900147
CL25171210P435E*830.63500 K804240455934900149
CL25171210P440E*830.64000 K804297462134900151
CL25171210P450E*830.65000 K804326465134900152
CL25171210P457E*830.65700 K804354468134900153
CL25171210P465E*830.66500 K804326465134900152
CL25171210P422E*930.62200 K903187342734900112
CL25171210P427E*930.62700 K903415367234900120
CL25171210P430E*930.63000 K903586385634900126
CL25171210P435E*930.63500 K903643391734900128
CL25171210P440E*930.64000 K903671394734900129
CL25171210P450E*930.65000 K903700397834900130
CL25171210P457E*930.65700 K903728400834900131



5.1 Color Binning Information


Figure 1: Graph of Test Bins in xy Color Space (Pulsed Test Conditions, Tj = 25°C)


CIE1931-x


Table 38: 2-Step to 5-step MacAdam ellipse color bin definitions for TYF CoB Core Range


Nominal

CCT

Center PointMAJOR AXIS (a , b)

Ellipse


Rotation Angel,θ

XY2-Step3-Step5-Step
2200K0.50180.4153(0.0048 , 0.0027)(0.0072, 0.0041)(0.0120, 0.0067)39.9
2500K0.48060.4141(0.0050, 0.0027)(0.0076, 0.0041)(0.0126, 0.0068)53.1
2700K0.45750.4101(0.0053, 0.0027)(0.0080, 0.0041)(0.0133, 0.0068)54.1
3000K0.43380.4030(0.0057, 0.0028)(0.0086, 0.0042)(0.0142, 0.0069)53.7
3500K0.40730.3917(0.0062, 0.0028)(0.0093, 0.0041)(0.0155, 0.0069)54.0
4000K0.38180.3797(0.0063, 0.0027)(0.0093, 0.0042)(0.0157, 0.0068)53.4
5000K0.34470.3553(0.0054, 0.0024)(0.0081, 0.0035)(0.0135, 0.0059)59.8
5700K0.32900.3417(0.0048, 0.0021)(0.0072, 0.0032)(0.0119, 0.0052)58.8
6500K0.31230.3282(0.0044, 0.0018)(0.0066, 0.0027)(0.0110, 0.0045)58.1

Notes for Table 39:

  • Driven the arrays at higher currents however lumen maintenance may be reduced.
  • Proper current derating must be observed to maintain junction temperature below the maximum
  • Pulsed operation with a peak drive current equal to the stated peak pulsed forward current is acceptable if the pulse on-time is ≤1ms per cycle and the duty cycle is ≤10%
  • Light emitting diodes are not designed to be driven in reverse voltage and will not produce light under this condition. Maximum rating provided for reference only.



Notes: 1. All dimension tolerance is ±0.2mm unless otherwise noted. 2. Tc measurement point at cathode



RECOMMENDED SOLDERING CONDITION

For manual soldering. Please use lead-free soldering and the soldering shall be implemented using a soldering bit at a

temperature lower than 350C, and shall be finished within 3.5 seconds for one land. No external force shall be applied

to resin part while soldering is implemented. Next process of soldering should be carried out after the product has

return to ambient temperature. CAUTION: TEMPERATURE CONTROL


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