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Via In Pad Treatment 8 Layer PCB Black Solder Mask FR4 TG170

Categories 8 Layer PCB
Brand Name: WITGAIN PCB
Model Number: PCB000332
Certification: UL
Place of Origin: China
MOQ: 1 pcs/lot
Price: negotiable
Payment Terms: T/T
Supply Ability: 100k pcs/month
Delivery Time: 20 days
Packaging Details: Vacuum bubble bag packaging
Layer Count: 8 Layer
Material: FR4 TG 170
PCB Thickness: 1.6 MM
Solder mask colour:: Black Solder Mask
BGA Size: 8 mil
Min Trace: 3/3 mil
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Via In Pad Treatment 8 Layer PCB Black Solder Mask FR4 TG170

8 Layer Via In Pad Treatment PCB Black Solder Mask


Main Features:


1 8 Layer Printed Circuit Board with very high relability.

2 PCB drawing size is 142mm*96mm/1pcs

3 Copper thickness is 35 um on each layer

4 FR4 substrate material ,halogen free material.

5 Surface treatment is immersion gold.

6 Gold thickness is 1U'.

7 Finished board thickness is 1.6mm.

8 Gerber file or PCB file should be offered by customer before production.


Our Equipment List:


NOEquipment NameEquipment BrandEquipment QTY
1Automatic CuttingSCHCLLING-CA68581
2Roll CuttingQIXIAN2
3Vertical CuttingSHANGYUE2
4Innerlayer pretreatmentJIECHI4
5Automatic coat&wiringQUNYU4
6Automatic exposureCHUANBAO11
7Large table exposureHECHUAN2
8Laser PlotterORBOTEC3
9Etching lineKB4
10PE PunchingPE-30001
11AOIORBOTEC10
12Double row brownKB3
13PP CuttingZHENGYE5
14PP ChoppingZHONGDA2
15Hot-melt machineHANSONG6
16Riveting machineJIAOSHI6
17X-Ray CheckHAOSHUO5
18Automatic refluxLANDE2
19Steel plate washerFENGKAI2
20Large size pressDATIAN8热4冷
21X-Ray Drilling targetHAOSHUO8
22Ccd Drilling targetXUELONG10
23Automatic grindingXINHAO5
24Plate thickness MeasuringAISIDA2
25Four axis gongs machineDALIANG2
26Two axis gongs machineBIAOTEFU4
27Automatic grinding millJIEHUI2
28Drilling machineTONGTAI13
29Hole testing machineYAYA1
30Sinking rough millKB1
31Vertical copper wireYAMEI1
32Automatic electroplating lineJINMING1
33Dryer after electroplatingKB1
34Etch machineKB1
35Film checking machineYUBOLIN2
36Line pre-processingKB2
37Automatic laminatorZHISHENG3
38Outer exposure machineCHUANBAO8
39Outer exposure machineHECHUAN3
40Etch machineJULONG1
41Line developing machineKB1
42Sand blasting machineKB1
43Precoarsening pretreatmentKB2
44Electrostatic spraying lineFURNACE1
45Automatic screen printing machineHENGDAYOUCHUANG12
46Pre baked tunnel furnaceKB1
47Solder resist exposure machineCHUANBAO6
48Solder resist exposure machineHECHUAN2
49Post baked tunnel furnaceGC0-77BD2
50Solder resist developing machineKB1
51Screen printing machine1.8mm/2.0mm4
52Character baking tunnel furnaceGC0-77BD1
53Sunk Tin spray line2
54Nickel palladium and gold wireXINHUAMEI1
55Alternator2
56OSP lineKB1
57Gongs machineYIHUI20
58V-CUTZHENGZHI1
59CNC V-CUT machineCHENGZHONG2
60Hydraulic punch pressSRT2
61Test machineMASON17
62High speed flying needle testerWEIZHENGTAI3
63Four wire flying needle testerXIELI2
64Product washing machineKB2
65Plate warping machineXINLONGHUI2
66Vacuum packaging machineSHENGYOU4

FAQ:


Q1:What is Via plugging? When is it used? How is it different from Via Tenting?


A1: Via plugging is a process in which vias are completely filled with resin or closed with a solder mask. This technique is different from via tenting where resin/solder mask doesn’t fill the via hole but just provides a covering.

Via plugging is done as a preventive measure to secure the vias from the unwanted flow of solder material during the assembly/soldering process. During the soldering process, if a via is not plugged or tented, the solder can flow down the via from the pads and can create unnecessary solder joints.


Via plugging can be done using conductive or non-conductive materials. The conductively filled vias help to carry a large amount of current from one side of the PCB board to another. However, the main drawback of conductively filled vias is the difference in CTE (Coefficient of Thermal Expansion) between the conductive fill and surrounding laminate. During PCB operation, the conductive material will heat and expand at a faster rate than the surrounding laminate, which can cause a fracture between the via wall and associated contact pad.


The via holes filled with non-conductive materials will still function like normal vias. However, they will not be able to carry higher current loads like those filled with conductive materials.


Quality Via In Pad Treatment 8 Layer PCB Black Solder Mask FR4 TG170 for sale
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