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| Categories | Thermal Conductive Gap Filler |
|---|---|
| Brand Name: | AOK |
| Model Number: | TM |
| Certification: | RoHS, Reach, UL |
| Place of Origin: | China |
| MOQ: | 400ml(200ml each part) |
| Payment Terms: | T/T |
| Delivery Time: | 13-15working days |
| Packaging Details: | 50ml(25ml each part)/ 400ml(200ml each part)/ 20kg(10kg each part) |
| Product Name: | Single Part 3W/m.K Silicone Thermal Conductivity Gap Filler For LCD TVs |
| Composition: | Ceramic filler + Silicone |
| Breakdown Voltage: | ≥5.0（kv/mm） |
| Usage Temperature: | -40~150（℃） |
| Flammability: | V-0 |
| Thermal conductivity: | 3.0（W/m.K） |
Single Part 3W/m.K Silicone Thermal Conductivity Gap Filler For LCD TVs
| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic filler + Silicone | - |
| Color | Green | Visual |
| Density(g/cc) | 2.9 | ASTM D792 |
| Extrudability(g/s) | 5.0 | ISO9048 |
| Usage Temperature(℃) | -40~150 | -- |
| Electrical | ||
| Breakdown Voltage(kv/mm) | ≥5.0 | ASTM D149 |
| Dielectric Constant(@10mhz) | 7.3 | ASTM D150 |
| Volume Resistivity(Ω.cm) | 1.0*1014 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal | ||
| Thermal conductivity(W/m.K) | 3.0 | ASTM D5470 |
Product feature
■ Thermal conductivity: 1.0-6.0 W/m.k
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications
■The thermal conductivity gap filler has ultra-low thermal
resistance, which can optimize the heat dissipation performance of
the product.
■The research and design is convenient. The thermal conductivity gap
filler is mud like and permanent self-adhesive. The product design
does not need to specially consider the limitations of product size
and tolerance, and can be flexibly designed according to the
effect.
■Convenience of purchase management. One model and specification of
thermal conductivity gap filler can meet the needs of multiple
models and products, greatly simplifying the purchase management
and storage management.
■The thermal conductivity gap filler can realize process automation.
The glue dispenser independently developed by sirnice or purchased
by the market can be used to realize the automatic glue dispensing
process, which greatly improves the construction efficiency,
reduces the labor cost and time cost, and optimizes the stability
of the product.
Typical applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
Purchasing information
Packing specification: 300ml Cartridge/ 1kg Jar/20kg Pail
Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or
oils.
• When using material from jar or pail, the container should be
sealed and closed immediately after usage to prevent foreign
material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic
Storage & Shelf life
Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.
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