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1 OZ Copper Aluminum Base PCB Circuit Boards 10 Layer 12 Mil

Categories Printed Circuit Boards
Brand Name: WITGAIN PCB
Model Number: PCB000371
Certification: UL
Place of Origin: China
MOQ: 1pcs/lot
Price: negotiable
Payment Terms: T/T
Supply Ability: 100kpcs/Month
Delivery Time: 20 days
Packaging Details: Vacuum package in bubble wrap
Layer Count: 10 Layer
Copper Thickness: 1 OZ on each layer
Drawing File Format: Gerber or PCB
Min BGA Size: 12 mil
Min Trace: 3.1 mil
Finished Thickness: 1.0 MM
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1 OZ Copper Aluminum Base PCB Circuit Boards 10 Layer 12 Mil

Printed Circuit Boards 10 Layer PCB With 1 OZ Copper On Each Layer


PCB Specifications:


1 All dimensions are in MM.

2 Fabricate per IPC-6012A Class2.

3 Materials:

3.1 Dielectric: FR4 Per IPC or equivalent

3.2 Min Tg: 170DEG

3.3 Copper: As per stack up

3.4 UL Rating: 94V0 Minimum

4 Surface finish: ENIG

5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed.

6 Editing of existing copper layers shall require customer approval.

7 Silkscreen legend to be applied per layer stackup using white non-conductitive epoxy ink.

8 100% continuity testing using database netlist shall be performed.Vendor to identify test passed in secondary side.

9 Vendor to mark date code and logo in legend secondary side.

10 Bow and twist shall not exceed 1.0% of longest side.

11 Vendor to provide panel drawing for customer approval before production.


S1130 Data Sheet:


S1130
ItemsMethodConditionUnitTypical Value
TgIPC-TM-650 2.4.25DSC135
TdIPC-TM-650 2.4.24.65% wt. loss310
CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃65
After Tgppm/℃310
50-260℃%4.5
T260IPC-TM-650 2.4.24.1TMAmin13
T288IPC-TM-650 2.4.24.1TMAmin<1
Thermal StressIPC-TM-650 2.4.13.1288℃, solder dip--60S No Delamination
Volume ResistivityIPC-TM-650 2.5.17.1After moisture resistanceMΩ.cm4.8E + 08
E-24/125MΩ.cm4.6E + 06
Surface ResistivityIPC-TM-650 2.5.17.1After moisture resistance5.2E + 07
E-24/1255.3E + 06
Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-4/23s120
Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-4/23kV60
Electrical StrengthIPC-TM-650 2.5.6.2D-48/50+D-4/23kV/mm
Dissipation Constant (Dk)IPC-TM-650 2.5.5.91MHz--4.6
IEC 61189-2-72110GHz--
Dissipation Factor (Df)IPC-TM-650 2.5.5.91MHz--0.016
IEC 61189-2-72110GHz--
Peel Strength(1oz HTE copper foil)IPC-TM-650 2.4.8AN/mm
After thermal Stress 288℃,10sN/mm1.8
125℃N/mm1.6
Flexural StrengthLWIPC-TM-650 2.4.4AMPa600
CWIPC-TM-650 2.4.4AMPa500
Water AbsorptionIPC-TM-650 2.6.2.1E-1/105+D-24/23%0.15
CTIIEC30112C-48/23/50,PLC 3
FlammabilityUL94C-48/23/50RatingV-0
E-24/125RatingV-0

Multilayer PCB Process:


Quality 1 OZ Copper Aluminum Base PCB Circuit Boards 10 Layer 12 Mil for sale
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