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AL2O3 Ceramic PCB Board Thickness 2.3MM 3OZ Copper

Categories Ceramic PCB Board
Brand Name: WITGAIN PCB
Model Number: CeramicPCB0005
Certification: UL
Place of Origin: China
MOQ: 1 pcs/lot
Price: negotiable
Payment Terms: T/T
Supply Ability: 100k pcs/month
Delivery Time: 20 days
Packaging Details: Vacuum bubble bag packaging
Place of Origin:: Guangdong China
Material:: Al203 Ceramic
No of layers:: 2 Layer
Copper Thickness: 3/3 OZ
Surface technics:: ENIG
Board Size: 120mm*100mm
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AL2O3 Ceramic PCB Board Thickness 2.3MM 3OZ Copper

AL2O3 Ceramic PCB Board Thickness 2.3MM 3/3OZ Copper


Main Features:

1 Part NO: CeramicPCB0005
2 Layer Count: 2 Layer PCB
3 Material Kind: AL203 Ceramic
4 Finished Board Thickness: 2.3MM
5 Copper Thickness: 3/3OZ
6 PCB Size: 120MM*100MM
7 Application Area: RF Power Supply


Our Product Categories:

Our Product Categories
Material KindsLayer CountsTreatments
FR4Single LayerHASL Lead Free
CEM-12 Layer/Double LayerOSP
CEM-34 LayerImmersion Gold/ENIG
Aluminum Substrate6 LayerHard Gold Plating
Iron Substrate8 LayerImmersion Silver
PTFE10 LayerImmersion Tin
PI Polymide12 LayerGold fingers
AL2O3 Ceramic Substrate14 LayerHeavy copper up to 8OZ
Rogers, Isola high frequency materials16 LayerHalf plating holes
Halogen free18 LayerHDI Laser drilling
Copper based20 LayerSelective immersion gold
22 Layerimmersion gold +OSP
24 LayerResin filled in vias



FAQ:

Q1:What are Copper Clad Laminates?
A1: A copper clad laminate is a laminate that has copper foil as its conducting layer. Laminates form the core of a PCB. It consists of layers of metal foil and prepreg (resin + reinforcement material) laminated together with heat and pressure. A laminate used for Printed Circuit Boards can have many different types of metal foil as its conducting layer. These include copper, aluminum, uranium, gold, palladium, carbon fiber, graphite etc. However, copper is used the most due to its excellent electrical characteristics and low cost.

Copper Clad Laminates are classified based on the copper weight, type of resin used, Reinforcement type, glass transition temperature, and various thermal and electrical properties.

The copper foil which is used as the conducting layer of the laminate is available in different specifications as laid out in IPC-4101. This standard also specifies the reinforcement type, the resin system the glass transition temperature range and flammability requirements for making quality copper clad laminate.

Copper Weight: Copper Weight or Copper Thickness in a Printed Circuit Board represents the thickness of 1 ounce of copper rolled out over an area of 1 square foot. It determines the current carrying capacity of a PCB. This is an important parameter that needs to be specified when selecting a copper clad laminate.

Resin: The type of resin used determines the mechanical properties related to stress and strain bearing capacity of the laminate and the thermal characteristics like the rate of expansion and curing properties, which again determine its rate of cross linking among molecular chains which determine its decomposition and glass transition temperature.

Phenolic Epoxy Polyester
PTFE Polyamide/Epoxy Epoxy/Multi Functional Epoxy
Bismaleimide Triazine(BT) Polyamide Polyimide Cyanate Ester
Cyanate Ester Epoxy/Phenolic Flame Resistant
Reinforcement: The choice of reinforcement used while manufacturing the laminate determines its tooling and drilling characteristics. Cotton and cellulose based laminates do not need to be drilled and can be punched to make a hole in it. Laminates made from a fiber of any kind like, glass, mat glass and quartz require special drilling practices, like closely monitoring the rate of wear of drill bit, the pressure applied to the drill bit and the spindle speed. This is because the thickness and granularity of the glass fibers, the thickness of the copper foil have a huge impact on the number of times a drill bit can be used, which ultimately has an impact on the final cost of making the laminate.

Cotton Paper
Woven Glass
Mat Glass
Cotton Paper/Woven Glass
Woven Glass/Mat Glass
Mat Glass/ Glass Veil
Woven Aramid
Woven Quartz Fiber
Woven E-Glass Surface/Cellulose Paper Core
A copper clad laminate is basically a combination of these layers. The combination determines various mechanical, physical, thermal and electrical properties of the laminate. The properties include the Glass Transition Temperature, the coefficient of thermal expansion. Electrical properties of the board include Dielectric Constant, loss tangent, insulation Resistance, surface resistivity and various other parameters.


Quality AL2O3 Ceramic PCB  Board Thickness 2.3MM 3OZ Copper for sale
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