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100 Ohm HDI PCB 10 Layer 10 MIL 1.6 MM FR4 TG170 Material

Categories HDI PCB
Brand Name: WITGAIN PCB
Model Number: HDIPCB0009
Certification: UL
Place of Origin: China
MOQ: 1pcs/lot
Price: negotiable
Payment Terms: T/T
Supply Ability: 100kpcs/Month
Delivery Time: 25 days
Packaging Details: vacuum package in bubble wrap
Layer Count: 10 Layer
Solder Mask: Green Solder Mask
Board Thickness: 1.6MM
Min Hole: 0.1MM
Copper Thickness: 1/H/H/H/H/H/H/H/H/1
Surface Treatment: Immersion Gold 2U'
Impedance Control: 100 Ohm
BGA Size: 10 MIL
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100 Ohm HDI PCB 10 Layer 10 MIL 1.6 MM FR4 TG170 Material

HDI PCB 10 Layer 1.6 MM Thickness FR4 TG170 Material


PCB Specifications:


1 Part NO: HDIPCB0009

2 Layer Count: 10 Layer HDI PCB

3 Finished Board Thickness: 1.6MM

4 Drilling: L1-L2 0.1MM, L3-L8 0.2MM, L9-L10 0.1MM, L1-L10 0.2MM

5 Min Lind Space&Width: 4/6mil

6 Copper Thickness: 1/H/H/H/H/H/H/H/H/1

7 Application Area: Automobiles


Our production applications:


1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules, gps modules, wifi modules, smart keys for cars, intelligent locks, floor mopping robots, zigbee, etc.

2 Industrial control:main boards in machines, industrial robots, servo motors etc.

3 Automotive: BMS main boards, automotive radar etc.

4 Power supplies: UPS, industrial power supply, frequency power supply.

5 Medical: medical equipment, medical equipment power supply.

6 Communication products: 5G base station, routers, satellites, antennas.


Our Product Categories:


Our Product Categories
Material KindsLayer CountsTreatments
FR4Single LayerHASL Lead Free
CEM-12 Layer/Double LayerOSP
CEM-34 LayerImmersion Gold/ENIG
Aluminum Substrate6 LayerHard Gold Plating
Iron Substrate8 LayerImmersion Silver
PTFE10 LayerImmersion Tin
PI Polymide12 LayerGold fingers
AL2O3 Ceramic Substrate14 LayerHeavy copper up to 8OZ
Rogers, Isola high frequency materials16 LayerHalf plating holes
Halogen free18 LayerHDI Laser drilling
Copper based20 LayerSelective immersion gold
22 Layerimmersion gold +OSP
24 LayerResin filled in vias

Packing Specifications:


1 One vacuum pcb package should not be over 25 panels based on panel size.

2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.

3 The pcb package must be suitable to ensure effective vacuum sealing.

4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.

5 Humidity indicator card target less than 10%.


Quality 100 Ohm HDI PCB 10 Layer 10 MIL 1.6 MM FR4 TG170 Material for sale
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