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4 Layers FR4 PCB Electronic Circuit Board Assembly & Multilayer PCBA Assembly SMT PCB Assembly

Categories SMT PCB Assembly
Brand Name: NA
Model Number: KAZ-B-NA
Certification: IATF16949-2016 | ISO9001 2015 | UL 337072 | ROHS
Place of Origin: Shenzhen China
MOQ: 1pcs
Price: 0.1usd
Payment Terms: T/T, Western Union, MoneyGram
Supply Ability: 100000 per Month.
Delivery Time: 3-15days
Packaging Details: anti-static bag
 Material: FR-4
 Copper Thickness: 1oz
 Soldmask & Silkscreen: Black & White
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4 Layers FR4 PCB Electronic Circuit Board Assembly & Multilayer PCBA Assembly SMT PCB Assembly

Professional PCB Assembly, PCBA OEM/ODM,PCBA Manufacturing;Components sourcing&components Alessembly


Features

  1. One Stop OEM Service, Made in Shenzhen of China
  2. Manufactured by Gerber File and BOM List from Customer
  3. Components procument
  4. Components Assembly
  5. Box building and testing
  6. FR4 Material, Meet 94V0 standard
  7. SMT, DIP technology suport
  8. Lead Free HASL, Environmental Protection
  9. UL, CE, ROHS Compliant
  10. Shipping By DHL,UPS, TNT, EMS or Customer requirement



PCB&PCBA Technical capability


SMTPosition accuracy:20 um
Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP
Max. component height::25mm
Max. PCB size:680×500mm
Min. PCB size:no limited
PCB thickness:0.3 to 6mm
PCB weight:3KG
Wave-SolderMax. PCB width:450mm
Min. PCB width: no limited
Component height:Top 120mm/Bot 15mm
Sweat-SolderMetal type :part, whole, inlay, sidestep
Metal material:Copper , Aluminum
Surface Finish:plating Au, plating sliver , plating Sn
Air bladder rate:less than20%
Press-fitPress range:0-50KN
Max. PCB size:800X600mm
TestingICT,Probe flying,burn-in,function test,temperature cycling



Manufacturer Capacity:


CapacityDouble Sided: 12000 sq.m / month
Multilayers: 8000sq.m / month
Min Line Width/Gap4/4 mil (1mil=0.0254mm)
Board Thickness0.3~4.0mm
Layers1~30 layers
MaterialFR-4, Aluminum, PI,MEGTRON MATERIAL
Copper Thickness0.5~4oz
Material TgTg135~Tg170
Max PCB Size600*1200mm
Min Hole Size0.2mm (+/- 0.025)
Surface TreatmentHASL, ENIG, OSP



SMT PCB assembly refers to the process of manufacturing a printed circuit board (PCB) using surface mount technology, where electronic components are placed and soldered directly to the PCB surface rather than inserted through holes.

Key aspects of SMT PCB assembly include:

Component placement:
SMT components such as resistors, capacitors, integrated circuits (ICs) and other surface mount devices are placed directly on the PCB surface using automated pick and place machines.
Precise component placement is critical to ensure accurate alignment and reliable electrical connections.

Solder paste deposition:
Solder paste is a mixture of solder alloy particles and flux that is selectively deposited on the copper pads of a PCB using stencil printing or other automated processes.
Solder paste acts as an adhesive and conductive material that will form the electrical connection between the components and the PCB.

Reflow soldering:
After the components are placed, the PCB assembly goes through a reflow soldering process that heats the board in a controlled environment to melt the solder paste and form electrical and mechanical connections between the components and the PCB.
Reflow profiles including temperature, time and atmosphere are carefully optimized to ensure reliable solder joints.

Automatically detect:
After the reflow process, PCB assemblies are automatically inspected using a variety of techniques, such as optical inspection, X-ray inspection, or automated optical inspection (AOI).
These inspections help identify and correct any problems such as soldering defects, component misalignment or missing components.

Testing & Quality Control:
Comprehensive testing, including functional, electrical, and environmental testing, is performed to ensure that PCB assemblies meet required specifications and performance standards.
Implements quality control measures, such as statistical process control and failure analysis, to maintain high manufacturing standards and product reliability.

The advantages of SMT PCB assembly:
Higher Component Density: SMT components are smaller and can be placed closer together, resulting in a more compact, smaller PCB design.
Improved reliability: SMT solder joints are more resistant to vibration, shock and thermal cycling than through-hole connections.
Automated manufacturing: The SMT assembly process can be highly automated, increasing production efficiency and reducing manual labor.
Cost-Effectiveness: SMT assembly can be more cost-effective, especially for high-volume production, due to reduced material and labor costs.

SMT PCB assembly applications:
Consumer Electronics: Smartphones, Tablets, Laptops, and Other Portable Devices
Industrial electronics: control systems, automation equipment and power electronics equipment
Automotive electronics: engine control units, infotainment and safety systems
Aerospace and defense: avionics, satellite systems and military equipment
Medical devices: diagnostic equipment, implantable devices and portable healthcare solutions

SMT PCB assembly is a foundational technology used to produce compact, reliable, and cost-effective electronic devices in a variety of industries.


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