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| Categories | Mitsubishi PLC Module |
|---|---|
| Place of Origin: | China/Japan |
| Brand Name: | Mitsubishi |
| Model Number: | FX3U-3A-ADP |
| Packaging Details: | Carton packaging |
| Supply Ability: | 10pc/per week |
| Price: | $50-$500 |
| MOQ: | 1/pc |
| Port: | Shenzhen & Guanzhou /Selectable |
| Payment Terms: | T/T, western union |
| Company Info. |
| Changsha Zhinian Automation Equipment Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
A high-precision analog input / output adapter with a resolution of
12-bit binary.
[Features]
-Two-channel input (voltage: DC0 to 10V or current: DC4 to 20mA)
and one-channel output (voltage: DC0 to 10V or current: DC4 to
20mA) are possible.
-Input is for each channel. Voltage or current input can be
specified.
-Data can be transferred without a program (without a dedicated
instruction).
[Application]
-Convenient for converting analog input signals to digital values
and digital values to analog output signals.
| Conformity standard | UL / cUL KC |
|---|
| Analog input | Analog input range | Voltage input | DC0-10V (input resistance 198.7kΩ) |
|---|---|---|---|
| Current input | DC4-20mA (input resistance 250Ω) | ||
| Number of input channels | 2 channels | ||
| Absolute maximum input | Voltage input | -0.5V, + 15V | |
| Current input | -2mA, + 30mA | ||
| Input characteristics | The input mode (voltage / current input) can be set for each channel. | ||
| Digital output | 12bit binary | ||
| resolution | Voltage input | 2.5mV (10V x 1/4000) | |
| Current input | 5μA (16mA x 1/3200) | ||
| Comprehensive accuracy | Voltage input | Ambient temperature 25 ° C ± 5 ° C: ± 0.5% (± 50mV) for full scale
10V Ambient temperature 0 ° C to 55 ° C: ± 1.0% (± 100mV) for full scale 10V | |
| Current input | Ambient temperature 25 ° C ± 5 ° C: ± 0.5% (± 80μA) for full scale 16mA Ambient temperature 0 ° C to 55 ° C: ± 1.0% (± 160μA) for full scale 16mA | ||
| A / D conversion time | When connecting FX3U / FX3UC sequencer | 80 μs x number of input channels used + 40 μs x number of output channels used (data is updated every calculation cycle) | |
| When connecting FX3S / FX3G / FX3GC sequencer | 90 μs x number of input channels used + 50 μs x number of output channels used (data is updated every calculation cycle) | ||
| Insulation method | ・ Insulation between analog input / output section and sequencer by
photocoupler ・ Insulation between drive power supply and analog input / output section by DC / DC converter ・ Non-insulation between each channel | ||
| Analog output | Analog output range | Voltage output | DC0-10V (external load resistance 5k-1MΩ) |
| Current output | DC4 to 20mA (external load resistance 500Ω or less) | ||
| Number of output channels | 1 channel | ||
| Output characteristics | The output mode (voltage / current output) can be set. | ||
| Digital input | 12bit binary | ||
| resolution | Voltage output | 2.5mV (10V x 1/4000) | |
| Current output | 4μA (16mA x 1/4000) | ||
| Comprehensive accuracy | Voltage output | Ambient temperature 25 ° C ± 5 ° C: ± 0.5% (± 50mV) for full scale
10V Ambient temperature 0 ° C to 55 ° C: ± 1.0% (± 100mV) for full scale 10V External load resistance (Rs) is less than 5kΩ In that case, the following calculation will be increased. (Increases by 100 mV per 1%.) 47 × 100 / (Rs + 47) -0.9 (%) | |
| Current output | Ambient temperature 25 ° C ± 5 ° C: ± 0.5% (± 80μA) for full scale 16mA Ambient temperature 0 ° C to 55 ° C: ± 1.0% (± 160μA) for full scale 16mA | ||
| D / A conversion time | When connecting FX3U / FX3UC sequencer | 80 μs x number of input channels used + 40 μs x number of output channels used (data is updated every calculation cycle) | |
| When connecting FX3S / FX3G / FX3GC sequencer | 90 μs x number of input channels used + 50 μs x number of output channels used (data is updated every calculation cycle) | ||
| Insulation method | ・ Insulation between analog input / output section and sequencer by
photocoupler ・ Insulation between drive power supply and analog input / output section by DC / DC converter ・ Non-insulation between each channel | ||
| Number of I / O occupied points | 0 points (not related to the maximum number of I / O points in the sequencer) | ||
| Applicable sequencer | FX3S, FX3G (Ver.1.20 or later), FX3U (Ver.2.61 or later), FX3GC,
FX3UC (Ver.2.61 or later) FX3S-CNV-ADP is required to connect to FX3S. FX3G-CNV-ADP is required to connect to FX3G. An expansion board is required to connect to FX3U and FX3UC-32MT-LT (-2). | ||
| mass | About 0.1kg | ||
| power supply | Conversion circuit drive power supply | DC24V + 20% -15% Connect a DC24V power supply to the 90mA terminal block and supply it. |
|---|---|---|
| Interface drive power supply | DC5V 20mA Internal power is supplied from the DC5V power supply of the basic unit. |
| Ambient temperature | 0-55 ℃ ・ ・ ・ ・ ・ During operation -25 ～ 75 ℃ ・ ・ ・ ・ ・ During storage | ||
|---|---|---|---|
| Relative humidity | 5 to 95% RH (no condensation) ・ ・ ・ ・ ・ ・ During operation | ||
| Vibration resistant | When mounting the DIN rail | Frequency: 10-57Hz | One-sided amplitude: 0.035mm X, Y, Z 10 times in each direction (80 minutes in total) |
| Frequency: 57-150Hz | Acceleration: 4.9m / s 2 X, Y, Z 10 times in each direction (80 minutes in total) | ||
| At the time of direct mounting | Frequency: 10-57Hz | One-sided amplitude: 0.075mm X, Y, Z 10 times in each direction (80 minutes in total) | |
| Frequency: 57-150Hz | Acceleration: 9.8m / s 2 X, Y, Z 10 times in each direction (80 minutes in total) | ||
| Impact resistance | 147m / s 2 , action time 11ms, sine and cosine half-wave pulse 3 times in each direction of X, Y, Z | ||
| Noise resistance | Based on a noise simulator with a noise voltage of 1,000 Vp-p, a noise width of 1 μs, a rise of 1 ns, and a period of 30 to 100 Hz. | ||
| Withstand voltage | Between all terminals and ground terminal: AC500V 1 minute | ||
| Insulation resistance | Between all terminals and ground terminal: 5MΩ or more with DC500V insulation resistance tester | ||
| ground | Class D grounding (grounding resistance: 100Ω or less) <Common
grounding with strong electrical system is not possible> Grounding should be dedicated grounding or shared grounding. | ||
| Atmosphere of use | No corrosive or flammable gas, no terrible conductive dust | ||
| Altitude used | It cannot be used in an environment where the pressure is 2000 m or less and the atmospheric pressure is higher than the atmospheric pressure. It may break down. | ||
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