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3030 390-400lm Smd LED Light Chip For Plantlighting

Categories LED Light Chip
Brand Name: PHOENIX
Model Number: CERAMIC3030
Certification: ANSI/ESDA/JEDEC JS-001
Place of Origin: SUZHOU
MOQ: 5000PCS
Price: Negotiation
Payment Terms: Western Union, MoneyGram, T/T
Supply Ability: 4000K PER MONTH
Delivery Time: 7-10 DAYS
Packaging Details: 4000PCS /ROLL
Name: SMD LED CERAMIC3030 BIUE
Power: 2W
nput Voltage(V): 3v
Luminous Flux(lm): 390-400lm
Warranty(Year): 2 years
Working Time (hours): 20000
Operating Temperature(℃): -40-85
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3030 390-400lm Smd LED Light Chip For Plantlighting

3V 700MA 2W CERAMIC3030 390-400LM SMD LED CHIP FOR PLANTLIGHTING

Characteristic
Dark blue (450 nm) and ultra red (660 nm) versions provide the light required for photosynthesis
The far infrared (730 nm) version can control the whole process of plants from germination to vegetative growth and then to flowerin
EQ white light can realize humanized working environment High energy efficiency( μ mol/J) Maximum drive current high,unique innovative radiation pattern. Paired with a customized phosphor solution, this latest LED illumi-nates plants evenly for uniform growth while facili-tating the increase of non-converted red photons to deliver superior fixture level efficacy.
Additionally,this high-power LED provides excellent reliability,ong lifetime, proven robustness and low thermal
Maximum Ratings

Parameter Symbol Values

Operating Temperature

T

op

min.

max.

-40 °C

120 °C

Storage Temperature

T

stg

min.

max.

-40 °C

120 °C

Junction TemperatureTmax.135 °C
Junction Temperature absolute*Tjabsmax.150 °C
Forward currentI

min.

max.

100 mA

1800 mA

Surge Current

t ≤ 10 µs; D = 0.005 %; TJ = 25 °C

FSmax.2000 mA
Reverse voltage 2)VNot designed for reverse operation

ESD withstand voltage

acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)

ESD8 kV

This is verified by testing 30 pieces. Pass criteria: No catastrophic failures allowed, luminous flux must be better than L70B50 after 1000 h.

Characteristics

I = 700 mA; TJ = 25 °C

Parameter Symbol Values

Viewing angle at 50% IV2φ typ. 140 °

Forward Voltage 4)

I = 700 mA

VF min. 2.80 V

typ. 2.90 V

max. 3.20 V

Reverse current 2)IR Not designed for reverse operation
Electrical thermal resistance junction/solderpoint with efficiency ηe = 65 %RthJS elec. typ. 1.6 K / W

Forward Voltage Groups

Group Forward Voltage 4)

I = 700 mA

VF:

2.8v2.9v
2.9v3.0v
3.0v3.1v
3.1v3.2v

Relative Spectral Emission

Irel = f (λ); IF = 700 mA; TJ = 25 °C


Radiation Characteristics

Irel = f (ϕ); TJ = 25 °C


Dimensional Drawing


Further Information: 29.0 mg


Approximate Weight: Package marking: Cathode

Corrosion test: Class: 3B

Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC 60068-2-43)

ESD advice: The device is protected by ESD device which is connected in parallel to the Chip.


Reflow Soldering Profile

Product complies to MSL Level 2 acc. to JEDEC J-STD-020E


Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit

Minimum Recommendation Maximum

Ramp-up rate to preheat*) 2

25 °C to 150 °C

3K/s

tS 60 100

T to T

120s

Ramp-up rate to peak*) 2

T to T

3K/s
Liquidus temperature TL 217°C
Time above liquidus temperature tL 80100s
Peak temperature T 245260°C

Time within 5 °C of the specified peak 10 20

temperature TP - 5 K

30s

Ramp-down rate* 3

T to 100 °C

6K/s

Time

25 °C to TP

480s

All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-


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