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| Categories | PA Hot Melt Adhesive Powder |
|---|---|
| Brand Name: | Easun |
| Model Number: | ES214 |
| Certification: | Rosh, Reach |
| Place of Origin: | China |
| MOQ: | 20KG |
| Price: | Negotiable |
| Payment Terms: | T/T |
| Supply Ability: | 4000000 |
| Delivery Time: | 3-8 working day |
| Packaging Details: | 20KG/bag |
| Color: | White |
| Composition: | Polyamide |
| Appearance: | White Powder |
| Melt Point(DSC): | 108-120 ℃ |
| Melt Flow Index: | 30±3 g/10min |
| Washable Property: | 90 ℃ |
| Powder size range: | 0-80 μm; 80-200 μm;150-250 μm |
| Density: | 1.10±0.02 g/cm³ |
| Packaging: | 20KG in one PE bag+Brown paper |
| Product type: | PA Hot Melt Adhesive Powder |
| Company Info. |
| East Sun New Material Technology (Shenzhen) Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
PA Hot Melt Glue Powder Polyamide Heat Transfer Adhesive Powder
PA Hot Melt Adhesive Powder Product model: ES214
Description:PA polyamide thermoplastic powder hot melt adhesive..It
has good adhesion and good washing resistance to textile
fabrics.Suitable for ordinary enzymatic washing.
Function:Heat transfer,Silk screen printing.
Physical Characteristics:
| Property | Criterion |
| Appearance | White powder |
| Composition | TPU |
| Density ASTM D-792 | 1.10±0.02 g/cm³ |
| Melt Point DSC | 108-120 ℃ |
| Melt Index ASTM D-1238 | 30±3 g/10min |
| Powder size range | 0-80 um |
| 80-200 um | |
| 150-250 um |
Technical Parameters:
| Bonding parameters (for reference only) | Temperature | 130℃ |
| Press | 3kg/cm2 | |
| Time | 14S | |
| Washing Resistance | 40℃ | Excellent |
| 60℃ | Excellent | |
| 90℃ | General |
Packaging and Storage Conditions:
| Packaging | 20KG in one PE bag+Brown paper bag |
| Storage Conditions | Stored in dry unopened packaging at room temperature for 12 months. High temperature and pressure will cause agglomeration. The trays cannot be double-pressed. |
1. The bonding conditions used will vary between machines and
materials. The conditions indicated here are only basic. The most
ideal bonding conditions should be established by manufacturing for
the specific application.
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