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| Categories | PES Powder |
|---|---|
| Brand Name: | Easun |
| Model Number: | ES205 |
| Certification: | Rosh, Reach |
| Place of Origin: | China |
| MOQ: | 25KG |
| Price: | Negotiable |
| Payment Terms: | T/T |
| Supply Ability: | 4000000 |
| Delivery Time: | 3-8 working day |
| Packaging Details: | 25KG/bag |
| Color: | White |
| Composition: | Copolyester |
| Appearance: | White Powder |
| Melt Point(DSC): | 125-135 ℃ |
| Melt Flow Index: | 22±8 g/10min |
| Washable Property: | 40℃ Excellent 60℃ Good 90℃Ordinary |
| Powder size range: | 0-80μm; 80-170 μm;150-250 μm |
| Density: | 1.20±0.02 g/cm³ |
| Packaging: | 25KG in one PE bag+Brown paper |
| Product type: | PES Powder |
| Company Info. |
| East Sun New Material Technology (Shenzhen) Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Copolymer PES Heat Transfer Powder Glue For Fabric Printing
PES Powder Product model: ES205
Description:PES powder hot melt adhesive excellent processability.
Function:Heat transfer,Silk screen printing.
Physical Characteristics:
| Property | Criterion |
| Appearance | White powder |
| Composition | Copolyester |
| Density ASTM D-792 | 1.20±0.02 g/cm³ |
| Melt Point DSC | 125-135 ℃ |
| Melt Index ASTM D-1238 | 22±8 g/10min |
| Powder size range | 0-80 um |
| 80-170 um | |
| 150-250 um |
Technical Parameters:
| Bonding parameters (for reference only) | Temperature | 140-160℃ |
| Press | 1.5-3.0kg/cm2 | |
| Time | 10-18S | |
| Washing Resistance | 40℃ | Excellent |
| 60℃ | / | |
| 90℃ | / |
Packaging and Storage Conditions:
| Packaging | 25KG in one PE bag+Brown paper bag |
| Storage Conditions | Stored in dry unopened packaging at room temperature for 12 months. High temperature and pressure will cause agglomeration. The trays cannot be double-pressed. |
1. Bonding temperature and pressure and time relate to the bonding
strength of the film to the material. The bonding temperature must
be close to the temperature set by the machine, the pressure must
be uniform, and the mold and press rolls must be flat.
2. The bonding conditions used will vary between machines and
materials. The conditions indicated here are only basic. The most
ideal bonding conditions should be established by manufacturing for
the specific application.
|
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