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Polyurethane Black DTF Powder

Categories Black DTF Powder
Brand Name: Easun
Model Number: ES226B
Certification: RoHS,REACH
Place of Origin: China
MOQ: 20KG
Price: Negotiable
Payment Terms: T/T
Supply Ability: 4000000
Delivery Time: 3-8 working day
Packaging Details: 20KG/bag
Color: Black
Composition: Polyurethane
Appearance: Black Powder
Melt Point(DSC): 105-115℃
Melt Flow Index: 30±5g/10min
Washable Property: 60 ℃
Powder size range: 40℃ Excellent 60℃ Good
Density: 1.21±0.02 g/cm3
Packaging: 20KG in one PE bag+Brown paper
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Polyurethane Black DTF Powder

Polyurethane Black DTF Powder


Black Hot Melt Adhesive Glue Pu Sublimation Powder Heat Transfer


Product model: ES226B


Description:This product is black thermoplastic polyurethane powdery hot melt adhesive. It has the special function of preventing the color migration (anti-sublimation) of the fabric. It has a soft hand feeling and good resilience and stretchability. It has excellent adhesion to textiles.


Application:
DS226B is used in textile, clothing and T-shirt heat transfer printing


Function:Heat transfer,Silk screen printing.


Physical Characteristics:


PropertyCriterion
AppearanceBlack powder
CompositionTPU
Density ASTM D-7921.12±0.03 g/cm³
Melt Point DSC105-115 ℃
Melt Index ASTM D-123825±5g/10min
Hardness ASTM D-224083±2 Shore A
Powder size range0-80 um
125-250 μm
150-250 um

Technical Parameters:


Bonding parameters (for reference only)Temperature110-140℃
Press1.5-2.5 kg/cm2
Time8-15S
Washing Resistance40℃Excellent
60℃/
90℃/

Packaging and Storage Conditions:

Packaging20KG in one PE bag+Brown paper bag
Storage ConditionsStored in dry unopened packaging at room temperature for 12 months. High temperature and pressure will cause agglomeration. The trays cannot be double-pressed.


1. Bonding temperature and pressure and time relate to the bonding strength of the film to the material. The bonding temperature must be close to the temperature set by the machine, the pressure must be uniform, and the mold and press rolls must be flat.

2. The bonding conditions used will vary between machines and materials. The conditions indicated here are only basic. The most ideal bonding conditions should be established by manufacturing for the specific application.



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