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| Categories | TPU Hot Melt Adhesive Powder |
|---|---|
| Brand Name: | Easun |
| Model Number: | ES225 |
| Certification: | Rosh, Reach |
| Place of Origin: | China |
| MOQ: | 20KG |
| Price: | Negotiable |
| Payment Terms: | T/T |
| Supply Ability: | 4000000 |
| Delivery Time: | 3-8 working day |
| Packaging Details: | 20KG/bag |
| Color: | White |
| Composition: | Polyurethane |
| Appearance: | Powder |
| Melt Point(DSC): | 100-120 ℃ |
| Melt Flow Index: | 20±5 g/10min |
| Washable Property: | 40 ℃ |
| Powder size range: | 0-80 μm; 80-200 μm;150-250 μm |
| Density: | 1.18±0.03 g/cm³ |
| Hardness: | 75±2 Shore A |
| Packaging: | 20KG in one PE bag+Brown paper |
| Product type: | TPU Hot Melt Adhesive Powder |
| Company Info. |
| East Sun New Material Technology (Shenzhen) Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
PU DTF Hot Melt Adhesive Powder For DTF Heat Transfer
Product model: ES225
TPU Hot Melt Adhesive Powder Description: hot melt adhesive powder of thermoplastic polyurethane. It has a soft feel and good resilience, stretching; easy processing; It has excellent bonding properties for textiles.
Function:Heat transfer,Digital printing,Silk screen printing.
Physical Characteristics:
| Property | Criterion |
| Appearance | White powder |
| Composition | TPU |
| Density ASTM D-792 | 1.18±0.03 g/cm³ |
| Melt Point DSC | 100-120 ℃ |
| Melt Index ASTM D-1238 | 75±2 Shore A |
| Powder size range | 0-80 um |
| 80-200 um | |
| 150-250 um |
Technical Parameters:
| Bonding parameters (for reference only) | Temperature | 115-130℃ |
| Press | 0.5-1.5 kg/cm2 | |
| Time | 8-15S | |
| Washing Resistance | 40℃ | Excellent |
| 60℃ | / | |
| 90℃ | / |
Packaging and Storage Conditions:
| Packaging | 20KG in one PE bag+Brown paper bag |
| Storage Conditions | Stored in dry unopened packaging at room temperature for 12 months. High temperature and pressure will cause agglomeration. The trays cannot be double-pressed. |
1. Bonding temperature and pressure and time relate to the bonding
strength of the film to the material. The bonding temperature must
be close to the temperature set by the machine, the pressure must
be uniform, and the mold and press rolls must be flat.
2. The bonding conditions used will vary between machines and materials. The conditions indicated here are only basic. The most ideal bonding conditions should be established by manufacturing for the specific application.
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