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Heat Transfer Printing Hot Melt Powder For Screen Printing

Categories TPU Hot Melt Adhesive Powder
Brand Name: Easun
Model Number: ES226
Certification: Rosh, Reach
Place of Origin: China
MOQ: 25KG
Price: Negotiable
Payment Terms: T/T
Supply Ability: 4000000
Delivery Time: 3-8 working day
Packaging Details: 20KG/bag
Color: White
Composition: Polyurethane
Appearance: Powder
Melt Point(DSC): 105-115℃
Melt Flow Index: 30±7g/10min
Washable Property: 60 ℃
Powder size range: 0-80 μm; 80-300 μm;100-400 μm
Density: 1.21±0.02 g/cm3
Hardness: 83±3 Shore A
Packaging: 25KG in one PE bag+Brown paper
Product type: TPU Hot Melt Adhesive Powder
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Heat Transfer Printing Hot Melt Powder For Screen Printing

Heat Transfer Printing Hot Melt Powder For Screen Printing


Product model: ES226


Description:This product is a copolyester thermoplastic powdery hot melt adhesive. Soft hand feel and certain resilience, excellent processability. Excellent adhesion to textiles, PVC, PC.


Function:Heat transfer,Digital printing,Silk screen printing.


TPU Hot Melt Adhesive Powder Physical Characteristics:


PropertyCriterion
AppearanceWhite powder
CompositionTPU
Density ASTM D-7921.2±0.02g/cm³
Melt Point DSC105-115 ℃
Melt Index ASTM D-123830±5g/10min
Powder size range0-80 um
0-170 um
80-200 um
125-200 um
150-250 um
180-420 um

Technical Parameters:


Bonding parameters (for reference only)Temperature105-120℃
Press3.0 kg/cm2
Time14S
Washing Resistance40℃Excellent
60℃good
90℃/

TPU Hot Melt Adhesive Powder Packaging and Storage Conditions:

Packaging25KG in one PE bag+Brown paper bag
Storage ConditionsStored in dry unopened packaging at room temperature for 12 months. High temperature and pressure will cause agglomeration. The trays cannot be double-pressed.


1. Bonding temperature and pressure and time relate to the bonding strength of the film to the material. The bonding temperature must be close to the temperature set by the machine, the pressure must be uniform, and the mold and press rolls must be flat.

2. The bonding conditions used will vary between machines and materials. The conditions indicated here are only basic. The most ideal bonding conditions should be established by manufacturing for the specific application.



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