CE 610mmx710mm LDI Laser Direct Imaging Machine PCB

laser direct imaging (LDI) system solutions for various PCB Multilayer

When Opt to LDI Technology?

Existing technologies are unable to offer acceptable solution and the inevitable results is reduced PCB production efficiency and lower yields. Nowadays, an average PCB trace width reaches 0.075mm (3mil) in complex multilayer PCBs. While photolithography imaging process unfortunately reached its limits due to creating high density interconnects on PCB. It is unable to creating PCB below 0.127/0.127mm (5/5mil) of trace widths and spaces. So, when most of the trace widths and spaces on a circuit board are smaller than 0.127/0.127mm (5/5mil), LDI is the best imaging option.

LDI technology is mainly used in HDI board manufacturing before. But now PCB manufacturers have to manufacture fine-line and ultra-fine-line conventional rigid, flex and rigid-flex PCBs with LDI technology where the trace widths and spaces of the conductive circuits are 0.075/0.075mm (3/3mil) or even 0.05/0.05mm (2/2mil). That’s because Laser Direct Imaging (LDI) has proved itself as the best and most comprehensive imaging solution for fine trace widths and spaces.

How does laser direct imaging ( LDI ) work?
Laser direct imaging needs a PCB with the photo-sensitive surface that is positioned under a computer controlled laser. And then the computer is creating the image on the board with the light of laser. A computer scans the board surface into a raster image, matching the raster image to a pre-loaded CAD or CAM design file that includes the specifications for the necessary image intended for the board, the laser is used for directly creating the image on the board.

About us
We are an innovative supplier of various PCB laser direct imaging (LDI) system solutions. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.

Jiangsu GIS Laser Technologies Inc. (hereafter referred to as GIS Laser) is a subsidiary of GIS Tech Inc. which is a multinational company providing advanced intelligent solutions into the industries of New Energy, Semiconductor Packaging, Lithium Battery, PCB and Printing, with its incredible innovation. through its independent Next Tech Research Institute, Business Division and Manufacturing Plant.

Our mission is to be a professional supplier in product solutions and services, striving for sustainable optimization and innovation in manufacturing capabilities for customers.

Our values are following with innovation, humility, perseverance, commitment.

GIS Tech has a strong professional R&D and after sales team with over 30 years experiences to enable the annual production output to be over 500 units, based on its professional manufacturing management SOP process through 10,000 square meter manufacturing center in Xuzhou city, Jiangsu province.

GIS Tech is the pioneer in introducing the DLP Technology into the laser imaging applications, owning the whole independent intellectual properties in the technologies of data processing, data transmission, sub-graph, electronic control, board card control, laser and optical lens etc. Our main products are CTS series (Computer to Screen system), CTP (Computer to Plate system) and fully automatic printing plate developing system.

GIS Tech is prepared to meet with new challenges in funding, technology, teams, applications, services, supply chains in the new future.

http://www.gis-group.com.cn/en/