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PLC PC 10 Zones SMT Reflow Oven Machine Lead Free Assembly Line

Categories SMT Reflow Oven
Brand Name: UA
Model Number: RF-H800Ⅰ
Certification: CE
Place of Origin: CHINA
MOQ: 1 unit
Price: Negotiable
Payment Terms: T/T
Supply Ability: USD
Delivery Time: 5-30 days
Packaging Details: vacuum packing for sea transportation
Weight (kg): Approx.2100
Control: PLC + PC
Parts Height: On Baoard 35mm / Under Board 20mm
Mesh Belt Width ( mm ): 460 ( or Customized )
Heating Zone Length (mm): 2932
Temp Accuracy: ± 1C
Machine Dimension (mm): 5150*1490*1510
Conveyor Speed (mm/min ): 20-1500
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PLC PC 10 Zones SMT Reflow Oven Machine Lead Free Assembly Line

PLC PC 10 Zones SMT Reflow Oven Machine Lead Free Assembly Line


Lead Free Reflow Oven, Assembly Line 10 Zones SMT Reflow Machine


Features

1. Heating mode is "upper circulating hot air + lower infrared hot air". It is equipped with three forced cooling zones.
2. Upper heating adopts microcirculation heating method, which can achieve large heat-air exchange and has very high heat exchange rate. It can reduce the setting temperature in the temperature zone and protect the heating elements. It is particularly suitable for lead-free welding.
3. Microcirculation heating mode, vertical air blowing and vertical air collecting can solve the problem of dead angle when using guide rail in reflow soldering.

Product Specification of Reflow Oven

ModleRF-H800I
Temp Accuracy± 1C
Temp Deviation± 2C
Weight (kg)Approx.2100
Cooling TypeForced-air Coooling
ControlPLC + PC
Power Supply3P/AC 380V OR 3P/AC 220V
Parts HeightOn Baoard 35mm / Under Board 20mm
Temp RangeRoom Temperature ~ 320C
Mesh Belt Width ( mm )460 ( or Customized )
Heating Zone Length (mm)2932
Options Available450/500 max PCB width
Central support for big PCB
Extra cooling zone
Cooling Zone length ( mm )600
Conveyor TypeChain and Mesh Belt
Temp Accuracy± 1C
Running / Starting Power (kw)8.5 / 33
Machine Dimension (mm)5150*1490*1510
PCB Width (mm)50 - 400 ( or customized )
Conveyor Speed (mm/min )20-1500

Soddle Profile
The componnetn is brought to a temperature of at least 240C for soldering. Using a saddle profile the board is gradually heated in line with pre-defined, individual temperature ranges. Even components with differing thermal masses are heated homogeneously and temperature differences mimimised.

Linear profile:

With a linear profile, the component is not heated in a stepped manner during soldering, in fact it is heated along anidentical linear temperature gradient. Linear profiles can reduce cycle times andcan help to reduce soldering errors suchas tombstoning.


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Quality PLC PC 10 Zones SMT Reflow Oven Machine Lead Free Assembly Line for sale
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