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Hybrid PCB Organic Ceramic Laminate RF-35 Taconic PCB 30mil 60mil

Categories Taconic PCB
Brand Name: Bicheng
Model Number: BIC-171.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: PTFE Ceramic Fiberglass
Layer Count: Double Layer, Multilayer, Hybrid PCB
PCB thickness: 10mil (0.254mm); 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc..
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Hybrid PCB Organic Ceramic Laminate RF-35 Taconic PCB 30mil 60mil


RF-35 Taconic High Frequency PCB with DK 3.5 Tg 315 10mil 20mil 30mil 60mil RF PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


RF-35 is an organic-ceramic laminate material in the ORCER (Organic Ceramic) family of Taconic products. It is based on woven glass reinforcement. RF-35 is the result of Taconic's expertise in both ceramic filling technology and coated polytetrafluoride (PTFE) fiberglass.


RF-35 is the best choice for low cost, high volume commercial microwave and radio frequency applications.It has an excellent peel strength for 1/2 ounce and 1 ounce copper (even compared to standard epoxy glass), a key aspect of the need for rework.


RF-35's Tg exceeds 315 ℃. Its ultra low moisture absorption rate and low dissipation factor minimize phase shift with frequency. RF-35 used woven fabrics in the design result in the stable dimension. The laminates are usually orderly clad on one side or both sides with 1/2,1 and 2 ounces electrodeposited copper respectively.


So we benefit from its low cost, excellent peel strength, exceptionally low dissipation factor, low moisture absorption and enhanced surface smoothness.


Applications

Power Amplifiers

Filters and Couplers

Passive Components


Our PCB Capability (RF-35)

PCB Material:PTFE Ceramic Fiberglass
Designation:RF-35
Dielectric constant:3.5
Dissipation Factor0.0018
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:10mil (0.254mm); 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc..

RF-35 Typical Value

PropertyTest MethodUnitValueUnitValue
Dielectric Constant @ 1.9 GHzIPC-TM 650 2.5.53.53.5
Dissipation Factor @ 1.9 GHzIPC-TM 650 2.5.50.00180.0018
Moisture Absorption (.060")IPC-TM 650 2.6.2.1%0.02%0.02
Peel Strength (1/2 oz. copper)IPC-TM 650 2.4.8lbs./linear inch>8.0N/mm>1.5
Peel Strength (1 oz. copper)IPC-TM 650 2.4.8lbs./linear inch>10.0N/mm>1.8
Dielectric BreakdownIPC-TM 650 2.5.6kV41kV41
Volume ResistivityIPC-TM 650 2.5.17.1Mohm/cm1.26 x 109Mohm/cm1.26 x 109
Surface ResistivityIPC-TM 650 2.5.17.1Mohm1.46 x 108Mohm1.46 x 108
Arc ResistanceIPC TM 650 2.5.1seconds>180seconds>180
Flexural Strength LengthwiseASTM D 790psi>22,000N/mm2>152
Flexural Strength CrosswiseASTM D 790psi>18,000N/mm2>124
Thermal ConductivityASTM F 433W/m/K0.24W/m/K0.24
Tensile Strength LengthwiseASTM D 638psi27,000N/mm2187
Tensile Strength CrosswiseASTM D 638psi21,000N/mm2145
Dimensional Stability LengthwiseIPC-TM 650 2.4.39in/in0.00004mm/mm0.00004
Dimensional Stability CrosswiseIPC-TM 650 2.4.39in/in-0.0001mm/mm-0.0001
x-y CTEASTM D 3386 (TMA)ppm/°C19-24ppm/°C19-24
z CTEASTM D 3386 (TMA)ppm/°C64ppm/°C64
FlammabilityUL-94V-0V-0
HardnessRockwell M Scale3434

TypeDk
TLY-5A2.17
TLY-52.20
TLY-32.33
TLT-0TLX-02.45
TLT-9TLX-92.50
TLT-8TLX-82.55
TLT-7TLX-72.60
TLT-6TLX-62.65
TLE-952.95
TLC-272.75
TLC-303.00
TLC-323.20
RF-303.00
RF-35RF-35P3.50
RF-606.15
CER-1010






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