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Flexible PCB with Polyimide Stiffener Flexible Printed Circuit (FPC) with PI Stiffener

Categories Flexible Printed Circuit
Brand Name: Bicheng Technologies Limited
Model Number: BIC-254-V3.91
Certification: UL
Place of Origin: China
MOQ: 1
Price: USD9.99-99.99
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
Delivery Time: 7 working days
Packaging Details: Vacuum
Board Material: Polyimide 25µm Shengyi 60℃
Board Thickness: 0.10mm
Surface Cu thickness: 35 µm
Surface Finish: Immersion Gold
Coverlay Colour: Yellow
Color of Silkscreen: White
Function: 100% Pass electrical test
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Flexible PCB with Polyimide Stiffener Flexible Printed Circuit (FPC) with PI Stiffener

Flexible PCB with Polyimide Stiffener Flexible Printed Circuit (FPC) with PI Stiffener

(FPC’s are custom-made products, the picture and parameters shown are just for reference)


General description

This is a type of single layer flexible printed circuit for the application of Wireless Dongle, 0.2mm thick. The base laminate is from Shengyi, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data. Polyimide stiffener is applied on the inserting head.


Parameter and data sheet

Size of Flexible PCB230.5 X 40.8mm
Number of Layers1
Board TypeFlexible PCB
Board Thickness0.20mm
Board MaterialPolyimide (PI) 25µm
Board Material SupplierITEQ
Tg Value of Board Material60℃
PTH Cu thickness≥20 µm
Inner Iayer Cu thicknesN/A
Surface Cu thickness35µm (1oz)
Coverlay ColourYellow
Number of Coverlay1
Thickness of Coverlay25 µm
Stiffener MaterialPolyimide
Stiffener Thickness0.2mm
Type of Silkscreen InkIJR-4000 MW300
Supplier of SilkscreenTAIYO
Color of SilkscreenWhite
Number of Silkscreen1
Peeling test of CoverlayNo peelable
Legend Adhesion3M 90℃ No peeling after Min. 3 times test
Surface FinishImmersion Gold
Thickness of Nickle/GoldAu: 0.03µm(Min.); Ni 2-4µm
RoHS RequiredYes
Famability94-V0
Thermal Shock TestPass, -25℃±125℃, 1000 cycles.
Thermal StressPass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Function100% Pass electrical test
WorkmanshipCompliance with IPC-A-600H & IPC-6013C Class 2


Features and benefits

Excellent flexibility

Reducing the volume

Weight reduction

Consistency of assembly

Increased reliability

Low cost

Continuity of processing

Focus on low to medium volume production

More than 18 years of experience


Applications

Mobile phone built-in antenna FPC, flex keyboard for mobile phone keys, Industrial control computer soft board


Stiffener

In many applications where there are components soldered, the flexible boards require external stiffeners (Stiffener, also known as the reinforcing board) for external support. The stiffener materials are PI or Polyester film, glass fiber, polymer materials, steel foil, aluminum shim and so on.


(1) PI or Polyester

PI and polyester films are commonly used stiffener materials for flexible circuit board. The commonly used thickness is 125μm (5mil), some hardness can be obtained.


(2) Glass fibers

Glass fibers (such as FR-4), which are also commonly used materials for stiffeners. The fiber glass stiffener has a higher hardness than that of PI or Polyester, used where the requirements of harness is higher. The thickness range is typically 125μm (5mil) to 3.175mm (125mils). However, its processing is relatively difficult than PI, and may not be a standing material for some FPC factories.


(3) Polymer

Polymer, such as plastic, etc. is also used as stiffeners.

Its water absorption is low, with high pressure and high temperature resistance.


(4) Steel foil, aluminum shim

The support hardness of steel foil, aluminum shim is high, the heat can also be dissipated. The hardness or heat dissipation in the design is the main concern.


More Displays of PI Stiffener


Quality Flexible PCB with Polyimide Stiffener Flexible Printed Circuit (FPC) with PI Stiffener for sale
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