| Sign In | Join Free | My frbiz.com |
|
| Sign In | Join Free | My frbiz.com |
|
| Categories | High Frequency PCB |
|---|---|
| Brand Name: | Bicheng Technologies Limited |
| Model Number: | BIC-0097-V5.5 |
| Certification: | UL |
| Place of Origin: | China |
| MOQ: | 1 |
| Price: | USD2.99-8.99 Per Piece |
| Payment Terms: | T/T, Paypal |
| Supply Ability: | 45000 pieces per month |
| Delivery Time: | 5-6 working days |
| Packaging Details: | Vacuum |
| Glass Epoxy: | RO3010 |
| Final height of PCB: | 0.3 mm ±0.1mm |
| Final foil external: | 1.0 oz |
| Surface Finish: | Immersion gold |
| Solder Mask Color: | Green |
| Colour of Component Legend: | White |
| TEST: | 100% Electrical Test prior shipment |
Rogers 3010 PCB RO3010 High Frequency PCB With 5mil, 10mil, 25mil and 50mil Coating Immersion Silver, Gold, Tin and HASL
(PCB's are custom-made products, the picture and parameters shown
are just for reference)
Hello Everyone,
Today we’re talk about RO3010 high frequency PCBs.
RO3010 high frequency circuit laminates are ceramic-filled PTFE
composites intended for using in commercial microwave and RF
applications. Its obvious characteristic is that the electrical
performance is exceptional and the mechanical property is stable
and consistent. This allows our designer to develop multi-layer
board without encountering warpage or reliability problems.
More features and applications are as follows:
1, Excellent mechanical properties versus temperature, it’s
reliable stripline and multi-layer board constructions.
2, Uniform mechanical properties, it’s suitable for use with epoxy
glass multi-layer board hybrid designs.
3, Low in-plane expansion coefficient matches to copper, it allows
for more reliable surface mounted assemblies; ideal for
applications sensitive to temperature change and exhibit excellent
dimensional stability.
Our PCB Capability (RO3010)
| PCB Material: | Ceramic-filled PTFE composite |
| Designation: | RO3010 |
| Dielectric constant: | 10. 2 ±0.3 (process) |
| 11.2 (design) | |
| Layer count: | 2 Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 5mil (0.127mm), 10mil (0.254mm), |
| 25mil (0.635mm), 50mil (1.27mm) | |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
RO3010 high frequency PCBs are available with double sided,
multi-layer and hybrid construction, 0.5oz to 2oz finished copper,
0.13 mm to 1.3mm thick, maximum size 400 mm by 500mm, surface
finish with bare copper, hot air leveling, immersion gold etc.
Typical applications
1. Automotive radar applications
2. GPS Antennas
3. Power amplifiers and antennas
4. Patch antennas for wireless communications
5. Direct broadcast satellite
The basic colour of RO3010 PCB is white.
The manufacturing process of RO3010 high frequency PCB is similar
to standard PTFE PCB, so it’s suitable for volume manufacturing
process winning advantageous market.
Should you have any questions, please feel free to contact us.
Thank you for your reading.
Appendix: Data Sheet of RO3010
| RO3010 Typical Value | |||||
| Property | RO3010 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 10.2±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 11.2 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0022 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -395 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.35 0.31 | X Y | mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 105 | MΩ.cm | COND A | IPC 2.5.17.1 | |
| Surface Resistivity | 105 | MΩ | COND A | IPC 2.5.17.1 | |
| Tensile Modulus | 1902 1934 | X Y | MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.05 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
| Specific Heat | 0.8 | j/g/k | Calculated | ||
| Thermal Conductivity | 0.95 | W/M/K | 50℃ | ASTM D 5470 | |
| Coefficient of Thermal Expansion (-55 to 288℃) | 13 11 16 | X Y Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | ℃ TGA | ASTM D 3850 | ||
| Density | 2.8 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 9.4 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
|
TMM13i High Frequency Printed Circuit Board 60mil 1.524mm Rogers Higher DK12.85 RF PCB With Immersion Gold
TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold
Rogers TMM10i Microwave Printed Circuit Board 75mil 1.905mm RF PCB With Pure Gold Plated.
TMM6 PCB Microwave Printed Circuit Board 50mil 1.27mm Rogers High Frequency PCB DK 6.0 With Immersion Gold
TC600 High Frequency PCB 50mil 1.27mm Double Sided Microwave Circuit Board With Immersion Silver
Taconic TLY-5Z High Frequency PCB 50mil 1.27mm TLY-5Z 2-Layer Printed Circuit Board with Immersion Gold
Rogers 5880LZ High Frequency PCB RT/duroid 5880LZ 50mil 1.27mm 2-Layer Circuit Board with Immersion Gold
RO4535 High Frequency PCB Rogers 4535 30mil 0.762mm Antenna Circuit Board 2-Layer with Immersion Gold
30mil RF-45 PCB High Frequency PCB with Blue Solder Mask Coating Immersion Silver on Pads
Taconic TRF-45 High Frequency Printed Circuit High Thermal Conductivity Circuit Board Low Loss PCB
