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Customized Hot Press High Temp Boron Nitride Ceramic Disc 2000C

Categories Boron Nitride Ceramic
Brand Name: ZG
Model Number: MS
Certification: CE
Place of Origin: CHINA
MOQ: 1 piece
Price: USD10/piece
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability: 10000 pieces per month
Delivery Time: 3 working days
Packaging Details: Strong wooden box for Global shipping
Application: Industry Ceramic
Maximum Working Tempreture: 2000℃
Material: Boron Nitride
Density: 2.0-2.1g/cm3
Composition: BN>99%
Type: Customization
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Customized Hot Press High Temp Boron Nitride Ceramic Disc 2000C


China Supplier Customizable Hot Press High Temperature Boron Nitride Ceramic Disc


Hexagonal Boron Nitride has a microstructure similar to that of Graphite. In both materials this structure, made up of layers of tiny platelets, is responsible for excellent machinability and low-friction properties. we called hexagonal boron nitride (HBN) or white graphite.


Material of Boron Nitride Ceramics

  • Pyrolytic Boron Nitride: 99.99% Boron Nitride*
  • 99 Boron Nitride: Boron Nitride + Boric Oxide (B2O3)
  • CABN: Boron Nitride + Calcium Borate
  • ALBN: Boron Nitride + Al2BO3
  • ZRBN: Boron Nitride + Zirconium Oxide + Boric Oxide (B2O3)
  • ZABN: Boron Nitride + Zirconium Oxide + Aluminum Nitride + Al2BO3
  • SCBN: Boron Nitride + Silicon Carbon + Al2BO3

Processing of Boron Nitride Ceramics

  • Hot Pressed Sintering
  • Chemical Vapor Deposition

Applications of Boron Nitrides Ceramics

  • Thermal Management
    Excellent electrical insulation and thermal conductivity make BN very useful as a heat sink in high-power electronic applications. Its properties compare favorably with beryllium oxide, aluminum oxide, and other electronic packaging materials, and are easier machinable to desired shapes and sizes.
  • High Temperature Environments
    Temperature stability and excellent resistance to thermal shock make BN the ideal material in the toughest high-temperature environments such as equipment for plasma arc welding, diffusion source wafers, and semiconductor crystal growth equipment & processing.
  • Molten Metal Handling
    BN is inorganic, inert, nonreactive with halide salts and reagents, and is not wet by most molten metals and slags. These characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processes.

Comparison of Boron Nitride Ceramics

GradeBN997BN99BN-SIBN-ALBN-SICBN-ZRBN-ALN
Main CompositionBN>99.7%BN>99%BN+AL+SIBN+ZR+ALBN+SICBN+ZRO2BN+ALN
Bonding CompositionB2O3B2O3Boron oxide siliconBoron oxide aluminumBoron oxide aluminumB2O3Boron oxide aluminum
Density (g/cm3)1.622.2-2.32.25-2.352.4-2.52.8-2.92.8-2.9
Room Temperature Electric Resistivity (Ω·cm)>1014>1014>1013>1013>1012>1012>1013
Max Using Temperature (℃)
In Atmosphere
In Inactive Gas
In High Vacuum (Long Time)
900
2100
1800
900
2100
1800
900
1750
1750
900
1750
1750
900
1800
1800
900
1800
1800
900
1750
1750
Three-Point Bending Strength (MPA)18356565809090
Compressive Strength (MPA)4585145145175220220
Thermal Expansion Coefficient (20-1000℃)
(10-6/K)
1.51.82.02.02.83.52.8
Thermal Conductivity (W/m·k)35403535453085
Typical Application:High Temperature FuranceHigh Temperature FurancePowder MetallurgyPowder MetallurgyPowder MetallurgyMetal CastingHigh Temperature
Equipment
High Temperature Electrical Furnace Components (High Temperature Insulator Sleeve Tube etc)YYYYYY
Metal Vaporize CrucibleYY
The Container Of Metal or Glass MeltingYYYYYYY
The Casting Mould Components Of The Precious Metal And Special Alloy.YY
High Temperature Support PartYYY
Nozzle And Transport Tube Of The Melting MetalYYYYYY
Remark: The value is just for review, different using conditions will have a little difference.

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