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Categories | Refractory Material |
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Brand Name: | ZG |
Model Number: | MS |
Certification: | CE |
Place of Origin: | CHINA |
MOQ: | 1 piece |
Price: | USD10/piece |
Payment Terms: | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
Supply Ability: | 10000 pieces per month |
Delivery Time: | 3 working days |
Packaging Details: | Strong wooden box for Global shipping |
Shape: | round, square, rectangular or other customized shapes |
Application: | Substrates, Wafers From Technical Ceramics For The Electronics Industry |
Feature: | Light weight;Large surface area through-hole rate;high pass rate ;Good chemical stability and corrosion resistance ;High mechanical strength;High thermal shock resistance |
Company Info. |
HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD |
Verified Supplier |
View Contact Details |
Product List |
Substrates, Wafers From Technical Ceramics For The Electronics Industry
Substrates based on Alumina (Al2O3), Aluminum nitride (AlN), Silicon nitride (Si3N4) and other ceramic materials, due to their properties, are widely used in the electronics industry.
Characteristic / Material | Al2O3 96% | Al2O3 99,6% | AlN | Si3N4 |
Apparent density, g/cm3 | 3,7-3,8 | 3,8-3,9 | 3,3 | 3,5 |
Vicker’s hardness , GPa | 16 | 21 | 11 | 15 |
Bending strength , MPa | 500 | 400 | 320 | 750 |
Elasticity modulus, GPa | 340 | 350 | 320 | 300 |
Thermal conductivity , W/(m·K) | 24 | 28 | 180 | 55 |
TCLE, 10-6/ºК | 6,8-8,0 | 6,8-8,5 | 4,7-5,6 | 2,7 |
Electric strength, KV/mm | 15 | 10 | 16 | 36 |
Volume resistance, Ohm*m | >1012 | >1012 | >1012 | >1012 |
Dielectric capacity | 9,8 | 9,9 | 8,9 | 8,5 |
Main applications:
Application features of products from Alumina (Al2O3)
Alumina (Al2O3) has an excellent combination of material
characteristics and the lowest cost. High mechanical strength,
hardness, wear resistance, fire resistance, thermal conductivity,
chemical inertia allow in some cases the replacement of more
expensive materials to reduce the cost of production.
The content of Al2O3 varies from 96% to 99.7%, thickness from 0.25
mm. The surface can be grinned or polished, metallization and any
geometry is possible.
Application features of products from Aluminum nitride (AlN)
Due to its excellent insulating properties, high thermal conductivity, strength and low coefficient of thermal expansion, aluminum nitride AlN is used in high-power electronic devices, insulated gate bipolar transistors (IGBT), communication systems, LED indicators, passive components, cooling devices, direct connection of components on cooper-loaded solder. The content of AlN varies from 96% to 99.7%, thickness from 0.25 to 11 mm. Processing options for thin-film and thick-film structures: grinding finish and polished surface. Metallization and any geometry is possible.
Application features of products from Silicon nitride (Si3N4)
Silicon nitride (Si3N4) has exceptional mechanical properties at
continuous thermal cycling, in deep vacuum, in the regime of
increased friction and in other severe operating conditions.
Excellent wear resistance and very high bending strength allow to
make substrates 0.3 mm thick, which gives low values of thermal
resistance (it can be compared with 1.0 mm thick aluminum nitride)
while significantly improving the mechanical characteristics that
are stable over a wide temperature range and other conditions of an
aggressive environment.
Silicon nitride has high radiation resistance, corrosion resistance
and considerable electrical strength compared to other ceramic
materials.
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