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2-inch Waffle Pack IC Chip Tray

Categories IC Chip Tray
Brand Name: Hiner-pack
Model Number: HN2078
Certification: ISO 9001 ROHS SGS
Place of Origin: Made In China
MOQ: 1000 pcs
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
Payment Terms: T/T
Supply Ability: The capacity is between 4000PCS~5000PCS/per day
Delivery Time: 5~8 working days
Packaging Details: It depends on the QTY of order and size of product
Material: ABS.PC.PPE.MPPO...etc
Color: Black.Red.Yellow.Green.White..etc
Property: ESD
Design: Standard
Size: 2 Inch
Surface Resistance: 1.0x10E4~1.0x10E11Ω
Clean class: General And Ultrasonic Cleaning
Incoterms: EXW,FOB,CIF,DDU,DDP
Injection Mold: Lead Time 20~25Days,Mold Life Span: 30~450,000 Times
Molding Method: Injection Moulding
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2-inch Waffle Pack IC Chip Tray

2-inch Waffle Pack IC Chip Tray

Custom cavity waffle packs tailored to your chip size, thickness, and handling method—ideal for high-value devices.


High temperature tray is an IC tray, an IC tray is a semiconductor chip enterprise for its chips for packaging and baking test carrier. Because it can be used in a 120℃-220℃bake environment without deformation characteristics, the electronic waste industry commonly known as "high temperature plate"


Antistatic plastic trays can eliminate static electricity, a large number of electronic devices and products in the production process of turnover loading, packaging, storage, and transportation. The finished product has good mechanical strength and heat resistance, Good impact resistance, and chemical corrosion resistance. It will not change its anti-static performance due to the environment, time, and temperature. It is mainly used in the electronics industry.

Advantages:

1. Lightweight, saving transportation and packaging costs;
2. Size specification, compatible with any 2 ", 3 ", or 4" Waffle Pack Feeder Machine;
3. Good anti-static performance, effectively ensures that the product is not damaged by anti-static release;
4. High temperature resistance, suitable for high temperature automation equipment assembly;
5. Corrosion resistance, suitable for all kinds of production conditions of products;
6. Matrix arrangement design, under the premise of protecting the product, the most dozen capacity design, cost saving;
7. Edge chamfer design effectively prevents stacking error, and corrects the direction of placement.

Technical Parameters:

Outline SizeMaterialSurface ResistanceServiceFlatnessColor
2"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM, ODMMax 0.2mmCustomizable
3"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM, ODMMax 0.25mmCustomizable
4"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM, ODMMax 0.3mmCustomizable
Custom sizeABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM, ODMTBCCustomizable
Provide professional design and packaging for your products


BrandHiner-packOutline Line Size50.7*50.7*4mm
ModelHN2078Cavity Size4.83*3.94*0.65 mm
Package TypeDieMatrix QTY10*8=80PCS
MaterialPCFlatnessMAX 0.2mm
ColorBlackServiceAccept OEM, ODM
Resistance1.0x10e4-1.0x10e11ΩCertificateRoHS

Application:

Semiconductor Wafer Die Wafer Bare, Electronic components, optical electronic components, etc.


FAQ:

Q: Can you do OEM and customized design IC trays?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase quantity of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value, and all samples shipping costs are normally is by collected or as agreed.
Q: What kind of Incoterms can you do?
A: We could support Ex works, FOB, CNF, CIF, CFR, DDU, DAP, etc., and other incoterms as agreed.
Q: What method can you help ship the goods?
A: By sea, by air, or by express, by mail, post, according to customer order quantity and volume.

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