Recycled ESD Custom JEDEC Trays Die Transport BGA Chips High Temperature Resistance

Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing ICs but also better protects the chip storage.We have designed a lot of packaging ways, which also include common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and SiP, etc. We can provide custom service for all packaging methods of the chip tray.

Benefits:

• Able to present non-standard components to the Pick and Place machines.

• Multiple uses for the fixture, including component bake-out, storage, and shipping.

• Cost-effective alternative to “tape and reel” or “hand” placement.

Application:

IC, Electronic component, Semiconductor, Micro and Nano systems, and Sensor IC, etc.

Technical Parameters:

FAQ:

Q1. Do your products get any certificates?
Yes, CE for the EU market, FDA for the USA market.
Q2.Can you do the design for us?
Yes. We have a professional team having rich experience in designing and manufacturing. Just tell us your ideas and we will help to carry out your ideas into a perfect fact. It does not matter if you do not have someone to complete the files. Send us high-resolution images, your logo, and text, and tell us how you would like to arrange them. We will send you finished files for confirmation.
Q3. How long is the delivery time?
For a standard machine, it would be 5- 7 working days. For non-standard/customized machines according to clients' specific requirements, It would be 20~25 working days.
Q4. Do you arrange shipments for the products?

It depends on our Incoterms. If it is FOB or CIF price, we will arrange shipment for you, but EXW price, clients need to arrange shipment by themselves or their agents.
Q5. How about the documents after shipment?
After shipment, we'll send all original documents to you by DHL, including Commercial Invoice, Packing List, B/L, and other certificates as required by clients.