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100% Laser Cut Solder Paste PCB SMT Stencil Through hole Fiducial mark

Name: 100 Laser Cut Solder Paste PCB SMT Stencil Through hole Fiducial mark
Brand: Bicheng
Price: 9.99 USD

100% Laser Cut Solder Paste PCB SMT Stencil Through hole Fiducial mark

Categories	PCB Stencil
Brand Name:	Bicheng
Model Number:	BIC-958.V1.0
Certification:	UL, ISO9001, IATF16949
Place of Origin:	CHINA
MOQ:	1PCS
Price:	USD9.99-99.99
Payment Terms:	T/T
Supply Ability:	5000PCS per month
Delivery Time:	8-9 working days
Packaging Details:	Vacuum bags+Cartons
Base material:	Stainless steel shim
Stencil size:	370mm x 470mm, 420mm x 520mm, 550mm x 650mm
Foil Thickness:	0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm
Appearance:	Engraving and electro polishing

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Bicheng Electronics Technology Co., Ltd

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100% Laser Cut Solder Paste PCB SMT Stencil Through hole Fiducial mark

Laser Stencil For SMT Solder Paste PCB Assembly Stencil Shim

1.1 General description

This is a type of solder paste SMT stencil (100% laser cut) built on 0.1mm stainless steel foil with aluminum frame 520 mm x 420 mm x 20mm dimension. It’s fabricated per IPC 7525A using supplied Gerber data, squeegee area locating in the center. Fiducal marks are through holes to suit for the SMT machine. It’s packed with KK carton (hard card) and usually 2 stencils are packed for shipment.

1.2 Features and benifits

The data file is used directly to produce and reduce the error rate;

The opening position accuracy of SMT template is very high: the whole process error is ≤ ±4 μ m;

The opening of SMT template has geometric figure, which is advantageous to the printing and forming of tin paste;

Engineering design prevents problems from occurring in pre production;

Comprehensive equipment management and maintenance and process control;

Diversified shipping method;

Professional and experienced engineers;

Competitive price;

Eligible products rate of first production: >99.99%

More than 9000 types per month;

1.3 Application

SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.

1.4 Parameter and data sheet

Dimension:	370mm x 470mm, 420mm x 520mm, 550mm x 650mm
Structure	Stencil foils with aluminum frame
Base material	Stainless steel shim
Foil Thickness	0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm
Aperture configured	Laser cut
Appearance	Engraving and electro polishing
Fiducial mark	Through hole
Service area:	Worldwide
Quantity of open pads:	1235
Advantages:	a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother.
Application:	CSP, BGA, 0.5mm QFP etc. package

1.5 Opening Holes Designs for SMT Stencil

Component Type	Pitch	Soldering Width	Soldering Length	Opening Width	Opening Length	Shim Thickness
PLCC	1.27mm	0.65mm	2.00mm	0.60mm	1.95mm	0.15-0.25mm
QFP	0.635mm	0.35mm	1.50mm	0.32mm	1.45mm	0.15-0.18mm
QFP	0.50mm	0.254-0.33mm	1.25mm	0.22-0.25mm	1.20mm	0.12-0.15mm
QFP	0.40mm	0.25mm	1.25mm	0.20mm	1.20mm	0.10-0.12mm
QFP	0.30mm	0.20mm	1.00mm	0.15mm	0.95mm	0.07-0.12mm
0402		0.50mm	0.65mm	0.45mm	0.60mm	0.12-0.15mm
0201		0.25mm	0.40mm	0.23mm	0.35mm	0.07-0.12mm
BGA	1.27mm	0.80mm		0.75mm	0.75mm	0.15-0.20mm
BGA	1.00mm	0.38mm		0.35mm	0.35mm	0.10-0.12mm
BGA	0.50mm	0.30mm		0.28mm	0.28mm	0.07-0.12mm
Flip Chip	0.25mm	0.12mm	0.12mm	0.12mm	0.12mm	0.08-0.10mm
Flip Chip	0.20mm	0.10mm	0.10mm	0.10mm	0.10mm	0.05-0.10mm

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