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10200 LABs ALTERA FPGA Chip

Categories ALTERA FPGA Chip
Brand Name: Intel / Altera
Model Number: EP3SE260F1152I3N
Certification: Lead free / RoHS Compliant
MOQ: 1 pcs
Price: USD 15000-20000 pcs
Payment Terms: T/T, Western Union, Paypal, Trade Assurance, Credit Card
Supply Ability: 72 pcs
Delivery Time: 3-5 Day
Packaging Details: International Standard Packaging
Category: IC FPGA
Condition: Original 100%,Brand New and Original,New
Series: Stratix III Enhanced
Number of Logic Array Blocks - LABs: 10200
Number of I/Os: 744 I/O
Package / Case: FBGA-1152
Operating Supply Voltage: 1.2 V to 3.3 V
Embedded Block RAM - EBR: 1594 kbit
Service: BOM Kitting
Lead time: In Stock,contact us
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10200 LABs ALTERA FPGA Chip

EP3SE260F1152I3N ALTERA FPGA Chip FBGA-1152 Stratix III Enhanced


Product AttributeAttribute Value
Intel
FPGA - Field Programmable Gate Array
Stratix III Enhanced
255000
10200
744 I/O
1.2 V to 3.3 V
- 40 C
+ 85 C
SMD/SMT
FBGA-1152
Tray
Series:Stratix III
Brand:Intel / Altera
Embedded Block RAM - EBR:1594 kbit
Moisture Sensitive:Yes
Product Type:FPGA - Field Programmable Gate Array
Factory Pack Quantity:24
Subcategory:Programmable Logic ICs
Total Memory:16282 kbit
Tradename:Stratix
Part # Aliases:972418

Stratix III devices offer the following features:
■ 48,000 to 338,000 equivalent logic elements (LEs) ( refer to Table 1–1)
■ 2,430 to 20,497 Kbits of enhanced TriMatrix memory consisting of three RAM block sizes to implement true dual-port memory and FIFO buffers
■ High-speed DSP blocks provide dedicated implementation of 9×9, 12×12, 18×18, and 36×36 multipliers (at up to 550 MHz), multiply-accumulate functions, and finite impulse response (FIR) filters
■ I/O:GND:PWR ratio of 8:1:1 along with on-die and on-package decoupling for robust signal integrity
■ Programmable Power Technology, which minimizes power while maximizing device performance
■ Selectable Core Voltage, available in low-voltage devices (L ordering code suffix), enables selection of lowest power or highest performance operation
■ Up to 16 global clocks, 88 regional clocks, and 116 peripheral clocks per device
■ Up to 12 phase-locked loops (PLLs) per device that support PLL reconfiguration, clock switchover, programmable bandwidth, clock synthesis, and dynamic phase shifting
■ Memory interface support with dedicated DQS logic on all I/O banks
■ Support for high-speed external memory interfaces including DDR, DDR2, DDR3 SDRAM, RLDRAM II, QDR II, and QDR II+ SRAM on up to 24 modular I/O banks



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