Sign In | Join Free | My frbiz.com |
|
Categories | Metallized Ceramic |
---|---|
Brand Name: | CMC |
Model Number: | CMC02 |
Certification: | IATF16949, ISO9001, ISO14001, ISO45001 |
Place of Origin: | China |
MOQ: | 2000 pieces |
Price: | USD 0.25~2.56/piece |
Payment Terms: | T/T, L/C |
Supply Ability: | 60,000 pieces per month |
Delivery Time: | 20 work days |
Packaging Details: | Plastic film+paper plate+carton |
Material: | 95% Alumina |
Color: | White |
Unit: | Piece |
Company Info. |
Hunan Meicheng Ceramic Technology Co., Ltd. |
Verified Supplier |
View Contact Details |
Product List |
CMC 02 metallized ceramics components
1.Application Field:
High Vacuum-tight Ceramic-to-metal joints with extremely high bond strengths, excellent consistency and high mechanical strength are good at heat transfer properties, minimum electric resistance and vacuum tightness. The metallic layers make the component suitable for integration by means of both hard and soft soldering. It’s widely used in typical applications such as Defense and Aerospace, Communications, lightning-protection, over current and over voltage protector etc.
2.Key Words:
Manufacture samples , open mould ,aluminum oxide,thick-film nickel plating technology,copper and alloys,great limberness,Good corrosion resistance,High intensity,Good high-temperature resistance performance,High purity.
3.Parameters:
Product Parameters | ||
Physical Property | Material | 95% Alumina |
Production Process | Dry Pressing+Brazing | |
Product Dimension | Per customers' drawing | |
Density (g/cm3) | 3.70-3.75g/cm3 | |
Water Absorption | 0% | |
Mechanical Performance | Flexural Strength (Mpa) | 310Mpa |
Modulus of Elasticity (Gpa) | 310Gpa | |
Hardness (Gpa) | 12.9Gpa | |
Poisson Ratio | 0.23 | |
Thermal Character | Linear Thermal Expansion Coefficient | 7.2 |
Heat Conductivity (W/mk) | 23 | |
Electrical Property | Dielectric Constant | 9.2 |
Dielectric Loss Tangent (x10-4) | 8 | |
Insulation Strength (x106V/M) | 15 | |
Metalized Ceramic Performance | Air Tightness (Pa·m3/s) | ≤10-8 |
Bulk Resistivity (Ω·cm) | ≥1010 (20°C), ≥106 (300°C) | |
Bonding Strength (Mpa) | ≥120Mpa | |
Metallization Thickness (μm) | ≥20μm |
![]() |