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| Categories | RA Copper Foil |
|---|---|
| Place of Origin: | China |
| Brand Name: | OEM |
| Supply Ability: | 550T Per Month |
| Packaging Details: | Exporting Wooden Case |
| MOQ: | 50kg |
| Price: | Negotiable |
| Certification: | ISO / SGS / RoHS |
| Delivery Time: | 10 - 15 Days |
| Payment Terms: | L/C, T/T |
| Application: | Electronics |
| Shape: | Lump |
| Material: | copper |
| Chemical Composition: | 9990 |
| Color: | RED |
| Standard: | ASTM/GB/DIN/JIS/ISO |
| Surface: | bright |
| Thick: | 8um/9um/12um |
| Company Info. |
| Beijing Silk Road Enterprise Management Services Co.,LTD |
| Verified Supplier |
| View Contact Details |
| Product List |
Shielding RA Copper Foil
Description:
Shielding Copper Foil Made of pure copper, copper grade T2(China),
C1100(Japan), C11000(USA), E-CU58(Germany), CU-ETP(EU, ISO). Copper
purity more than 99.95%. This is RA copper foil, one side is
polished side and the other side is matte. We also have ED copper
foil, ED copper foil can choose one side polished and double side
polished. The ED copper can have a higher purity. welcome to
contact us if you need it.
Width, length, thickness all can be customized. we can also provide
DIE cutting service.
We are also copper foil processing factory, Backing adhesive glue
on the copper foil, laminate the copper foil with polymer films
like PET, PI, PE and other films. DIE cut into customized shapes.
you can send us your drawings and we can cut it into your shapes.
Chemical Content, %
Cu | Bi | Sb | As | Fe | Ni | Pb | S | Zn | ROHS Directive | |||
Cd | Pb | Hg | Cr | |||||||||
99.90 | 0.001 | 0.002 | 0.002 | 0.005 | - | 0.005 | 0.005 | - | ND | ND | ND | ND |
Physical Properties
| Item | DB44/837-2010 standard | Q/HZY001-2012 standard | |||||||||
| Double side polished | Single side polished | Double side polished | Single side polished | ||||||||
| Standard Thick | um | 8 | 9 | 12 | 9 | 7 | 8 | 9 | 12 | 8 | 9 |
| Basic weight | g/m2 | 70-75 | 85-90 | 100-105 | 85-90 | 62-65 | 70-75 | 85-90 | 100-105 | 70-75 | 85-95 |
| Test thickness | um | / | / | / | / | ≤8 | ≤9 | ≤10 | ≤13 | ≤10 | ≤11 |
| Cu | % | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 | ≥99.8 |
| TS | Room | ≥294 | ≥294 | ≥294 | ≥245 | ≥294 | ≥294 | ≥294 | ≥294 | ≥245 | ≥245 |
| 180℃ | ≥196 | ≥196 | ≥196 | ≥147 | ≥196 | ≥196 | ≥196 | ≥196 | ≥147 | ≥147 | |
| Ductility | Room | ≥5 | ≥5 | ≥5 | ≥2.5 | ≥5 | ≥5 | ≥5 | ≥5 | ≥2.5 | ≥2.5 |
| 180℃ | ≥3 | ≥3 | ≥3 | ≥2 | ≥3 | ≥3 | ≥3 | ≥3 | ≥2 | ≥2 | |
surface roughness | Polished side | ≤3 | ≤3 | ≤3 | ≤3 | ≤3 | ≤3 | ≤3 | ≤3 | ≤3 | ≤3 |
| Coarse side | ≤0.3 | ≤0.3 | ≤0.3 | ≤0.5 | ≤0.3 | ≤0.3 | ≤0.3 | ≤0.3 | ≤0.5 | ≤0.5 | |
| wettability | mN/m | ≥32 | ≥32 | ≥32 | ≥32 | ≥32 | ≥32 | ≥32 | ≥32 | ≥32 | ≥32 |
| high temperature oxidation resistance | 160℃/10 min copper foil surface should be no oxidation discoloration | 180℃/10 min copper foil surface should be no oxidation discoloration | |||||||||
Application of Copper foil
1) Electric and electricsprings,switches
2) Lead frames
3) Connectors and oscillation reeds
3) PCB field
4) Communication cable, Cable armoring, Mobile phone mainboard
5) Ion battery production lamination with PI film
6) PCB collector(electrode backing) materials
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