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| Categories | UV Laser Marking Machine |
|---|---|
| Place of Origin: | CHINA |
| Certification: | ISO,CE |
| MOQ: | 1 set |
| Price: | Negotiation |
| Packaging Details: | Wooden cases standard export package |
| Delivery Time: | 5-7 working days |
| Payment Terms: | T/T, Western Union, MoneyGram |
| Supply Ability: | 200-500 Sets/Month |
| Name: | Ultraviolet Laser Marking Machine |
| Laser Type: | UV Laser |
| Working Accuracy: | 0.02mm |
| Application: | Laser Marking |
| Beam diameter: | less 8mm |
| Wavelength: | 355nm |
| Weight (KG): | 280 KG |
| Key Selling Points: | High Safety Level |
| Laser power: | 3W/5 W/10W |
| Marking Speed: | 0-7000mm/s |
| Applicable Material: | Special for plastic, glass |
| Marking Area: | 110mm*110mm |
| Company Info. |
| Beijing Silk Road Enterprise Management Services Co.,LTD |
| Verified Supplier |
| View Contact Details |
| Product List |
355nm 3W 5W 10W UV Laser Marking Engraving Machine
Low Power DPSS UV Lasers (3W/5W) is featured with compact structure
with extremely convenient installation and debugging. They have
adopted the built-in laser diode technology to avoid the effect of
fiber shaking on output laser. Besides, the beam quality is
excellent enough to ensure the stability and reliability for mass
production, which can meet the special manufacturing and processing
demand in harsh industrial working condition.
No | Parameter | Unit |
1 | Model | SL-UV 3W/5W10W |
2 | Laser wavelength | 355nm |
3 | Average power | > 3W@40kHz |
4 | Pulse Repetition Rate | 20kHz-200kHz |
5 | Spatial Mode | TEM00 (M2 1.2) |
6 | Pulse Width | 15ns@ 40kHz |
7 | Working Materials | Nd:YVO4 |
8 | Beam-pointing Stability | 25μrad |
9 | Beam Roundness | 90% |
10 | Beam diameter | less 8mm |
11 | Beam Divergence | less 2mrad |
12 | Pulse to pulse stability | less 3%rms |
13 | Ambient temperature | 18-35 degree |
14 | Cooling | Water cooling |
15 | Power consumption | 500W |
16 | Classification | Class4 |
UV laser marking machine widely used in 3C industry marking, as
well as industrial micro machining, including marking for a
diversity of materials, plastic,glass, LED scribing, laser rapid
prototyping, removal of metal and non-metal coating, silicon wafer
processing and so on.
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