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Thin Flim Aluminum Nitride Aln Ceramic Substrate

Categories Ceramic Substrate
Brand Name: Jinghui Ceramics
Model Number: Customized
Certification: RoHS, REACH, ISO
Place of Origin: China
MOQ: 1 piece per order
Price: Negotiable
Payment Terms: T/T, Western Union, MoneyGram, Paypal, , L/C
Supply Ability: 10000 pieces per month
Delivery Time: 4~5 weeks after receiving the order
Packaging Details: Export carton with wooden case
Product name: Aln Ceramic Wafer
Color: Gray, Yellowish
Material: Aluminum nitride
Density: Over 3.30g/cm3
Size: Max. OD 400mm
Thickness: 0.30 mm - 10 mm
Feature: High Thermal Conductivity
Usage: Heat dissipation substrate, LED package, Power module
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Thin Flim Aluminum Nitride Aln Ceramic Substrate

Thin Flim High Thermal Conductivity Aluminum Nitride AlN Ceramic Wafer

The specification of the AlN Ceramic wafer

1. We are supplying with many round ceramic wafers, square & rectangular ceramic substrates
2. The typical thickness of AlN wafers covers 0.38mm, 0.5mm, 0.635mm, 1.0mm, 1.2mm, 1.5mm
3. The biggest diameter of the round ceramic wafer can be up to 400mm in 3mm, 4mm, 5mm thick
4. The max. side-length of the square and rectangular ceramic wafer can be 400mm by 500mm
5. Surface treatment: it can be one-side, or double side polished, metalizing or sandblasting
The main features of the AlN ceramic wafer
1. High thermal conductivity (170 ~220) W/m.k, it's 5~8.5 times higher than that of alumina
2. Similar coefficient of thermal expansion to that of silicon (Si), it helps to achieve high reliability of Si chip
3. High insulation resistance and voltage resistance strength, but low dielectric constant and dielectric loss
4. High mechanical strength, it's up to 450MPa and very dense ceramic body free of porosity
5. It offers very high purity up to 99%, also it's free of toxicity and meets RoHS, REACH regulation

The description of the AlN ceramic wafer
Our facility has been manufacturing aluminum nitride (AlN) wafers for ages, including a selection of thickness from 0.30mm to 10mm.

With both extremely high thermal conductivity (170-220W/mK) and insulating properties. These ceramic wafers can be the best solution in electronics applications where strict conditions are required, such as power modules (MOSFET, IGBT), LED packages for protecting circuits, cooling, packages, and modules.

Property Datasheet of AlN Ceramic Wafers and Ceramic Substrates

GeneralPropertiesUnitValue
MechanicalPurity%≥99
Volume Densityg/cm3≥3.30
ColorGray
Porosity%0
Compressive StrengthMPa-
Bending StrengthMPa450
Elastic ModulusMPa330
Fracture toughnessMpam1/23
ThermalMax. service temperature (Non-loading)1800
Thermal Conductivity (25℃)W/m.k≥170
Coefficient of Thermal Expansion (CTE)1*10-6 m/k4.6
Specific heat1 x 103J/(kg·K)0.74
ElectricalVolume Resistivity (25℃)ohm.cm1*1014
Insulation BreakdownKV/mm25
Dielectric constant (1Mhz)(E)8.7

Why choose us?

1.With 15 years of manufacturing experience in OEM, ODM


2. Powerful R&D, customized and mass production capability



3. In-house comprehensive manufacturing types of equipment



4. Rigorous quality control system and processes



FAQs (Frequently Asked Questions)

Q1: Is it available to provide customized products?
A: We always support custom-made demand as per different materials, dimensions, and designs.

Q2. Are you a factory or trading company?
A: We are a direct manufacturer of technical ceramic components. You are welcome to visit our factory.
Q3: When can I get the price?
A: We regularly quote within 24 hours after we get your inquiry. If you are in urgent need of getting the price.
Please call us or tell us in your email so that we will proceed with your inquiry as a priority.
Q4: How to ensure quality?
A: We have a complete strict quality-control system, including IQC, IPQC, QA, OQC per ISO9001: 2008
Q5: What other products are you dealing with?
A: We also focus on a variety of metalized ceramics, high precision zirconia ceramic parts, ceramic seals.

Quality Thin Flim Aluminum Nitride Aln Ceramic Substrate for sale
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