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| Categories | Grinding Wheel For Semiconductor And Photoelectricity |
|---|---|
| MOQ: | 1PC |
| Price: | Negotiable |
| Payment Terms: | T/T |
| Supply Ability: | 20000 pcs per month capacity |
| Delivery Time: | 10-14 days delivery time |
| Packaging Details: | Box |
| Place of Origin: | China |
| Certification: | High QC standard, 100% inspection |
| Bonding Agent: | Resin |
| Common Shape: | 1A1 |
| Type:: | Cutting Tool |
| Feature: | High efficiency |
| Key word: | Centerless Wheels |
| Grit size: | Resin bond the finest grit size is 3000 |
| Company Info. |
| Xinzheng Dia Abrasives Co.,Ltd |
| View Contact Details |
| Product List |
Centerless grinding is a machining process that uses abrasive cutting to remove material from a workpiece. Centerless grinding differs from centered grinding operations in that no spindle or fixture is used to locate and secure the workpiece; the workpiece is secured between two rotary grinding wheels, and the speed of their rotation relative to each other determines the rate at which material is removed from the workpiece.
Features:
Specification:
| Common Shape | Wheel Size | Grit Size | Classic Specification |
| 1A1 | Resin Maximum OD is 750mm Vitrified OD:300mm~500mm | Resin the finest grit size is 3000 |
Application
| Industry | Workpiece&Material | Machine | Bond | Working Data |
| Semiconductor and Photovoltaic industries | Ceramic, magnet, sapphire | Resin Vitrified |
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