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Multi Layers PCB Prototype Service , Pcb Fabrication And Assembly 35um Copper Thickness

Categories Ultra Thin PCB
Brand Name: China chao sheng
Model Number: CSPCB1331
Certification: ISO/UL/RoHS/TS
Place of Origin: Shenzhen, Guangdong, China
MOQ: 1PCS
Price: usd2.6/pcs
Payment Terms: T/T, Western Union
Supply Ability: 2000000pcs/per month
Delivery Time: 15-18day
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Product Areas: SG card, SDcard,GMcard
Min. Line Spacing: 1/2 Oz. Copper .003" +/- .0005" (0.0762mm)
Surface Finishing: Shen Jin + Golden Finger Thick Gold 30U "
Minimum Hole: 0.10
Minimum Line Width And Space: 8:1
Provide PCB Information: Gberber, Production Requirements, MOQ Quantity
Copper Thickness: 35um
Board Thickness: 0.30mm
Product Structure: 4-6-layer HDI
Impedance Value: ± 10%
Surface Treatment: Immersion Gold, Electro-nickel Gold, Immersion Tin, OSP, Lead-free Spray Tin
PCBA Information: BOM Report, X, Y Left Plot
TEST: 100% Electrical Test Prior Shipment
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Multi Layers PCB Prototype Service , Pcb Fabrication And Assembly 35um Copper Thickness

Printed circuit board (pcb) and PCBA product areas
Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
Winding circuit board (fpc) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

PCB, FPC process production capability

Technical ltemMassProductAdvanced Technology
201620172018
Max.Layer Count26L36L80L
Through-hole plate2~45L2~60L2~80L
Max.PCBSize(in)24*52"25*62"25*78.75"
The layer number of FPC1~36L1~50L1~60L
Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
Layeredplatelayer2~12L2~18L2~26L
Max.PCBSize(in)9"*48"9"*52"9"*62"
Combination of hard and soft layers3~26L3~30L3~50L
Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
HDI PCB4~45L4~60L4~80L
Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
Max.PCBSize(in)24"*43"24"*49"25"*52"
MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
Build-up MaterialFR-4FR-4FR-4
BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
Min.18L(mm)0.632.0~8.00.51~10.0mm
Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
MAX(mm)3.510.0mm10.0mm
Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
Gold thick1~40u"1~60u"1~120u"
Nithick76~127u"76~200u"1~250u"
Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
DieletricThickness38(1.5)32(1.3)32(1.3)
125(5)125(5)125(5)
SKipviaYesYesYes
viaoNhie(laserviaon BuriedPTH)YesYesYes
Laser Hole FillingYesYesYes
TechnicalltemMass ProductAdvanced Technolgy
2017year2018year2019year
Drill hole depth ratioThroughHole2017year.40:1.40:1
Aspet RatioMicro Via.35:11.2:11.2:1
Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
BGAPitch mm(Mil)0.30.30.3
Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
Line Width Control∠2.5MIL±0.50±0.50±0.50
2.5Mil≤L/W∠4mil±0.50±0.50±0.50
≦3mil±0.60±0.60±0.60
Laminated structureLayer by layer3+N+34+N+45+N+5
Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
Multi-layer overlayN+NN+NN+N
N+X+NN+X+NN+X+N
sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
PTH filling processPTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

FAQ:

Q: What files do you use in PCB fabrication?

A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

Q: Is it possible you could offer sample?

A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?

A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

Q: How can I make sure the quality of my PCB?

A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

Multi Layers PCB Customization, PCB Prototype, PCB Assembly, PCB Fast Service, PCB OEM Service, PCBA prototyping prototype pcb service pcb service

Specifications

We are the manufacturer with ISO standard certification in GuangDong China that specialize in producing all kinds of PCB(print Circuit Board) with reliable quality. All products are selled by Factory Price.
the price is variable according to the complexity of your design. You can send your inquiry with required documents( such as Gerber File, Protel or DXP format File, Cadence format File, PADS format file). We will reviews your files and reply in a few hours with competitive price and valuable comments & suggestions.
We also have PCB SMT Production Line and can provide SMT service. If you have similar requirements, please contact us.

Specifications
1NO. LAYER1-32(Batch Process)
1-32 (Sample Board)
2FINISHED BOARD SIZE (MAX)520mm X 1040mm
3BOARD THICKNESS (MAX)5.0mm
4BOARD THICKNESS (MIN)0.50mm
5DRILLED HOLE DIAMETER (MIN)0.25mm
6DIELECTRIC MATERIAL (MIN)CEM-3 FR4(130C Tg)
Rogcrs4003 FR4(140C Tg)
FR4(150-170C Tg)
7HOLE DIAMETER TOLERANCE (PTH)+/-2mils(Batch Process)
8HOLE DIAMETER TOLERANCE (NPTH)+/-2mils(Batch Process)
9LAYERLINE WIDTH/SPACING (MIN)H/H Oz is 3mil/3mil
1/1 oz is 3mil/3mil
2/2 oz is 5mil/5mil
10SOLDER MASK THICKNESS (MIN)10 Um
11IMPEDANCE TOLERANCE (MIN)+/-10%
12Surface Processing

1. HASL
2. HASL Leadfree

3. Deposited Nickel/Gold
4. OSP

13THERMAL STRESS TEST288 Centigrade,10 sec
One Shot
14FLAMMABILITY94V-0


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