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High Thermal Expansion Copper Molybdenum Heat Base Cu / MoCu / Cu ( CPC ) Sheet

Categories Molybdenum Copper
Brand Name: JBNR
Model Number: CPC141,CPC232,CPC300
Place of Origin: CHINA
MOQ: Negotiation
Price: Negotiable
Payment Terms: L/C, , T/T, Western Union
Delivery Time: 15days
Packaging Details: as customer required
Material: copper/moly copper/copper
Density: 9.2
CTE: 9.5
TC: 260
Application: Power Device Package
Plating: Nickel and gold
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High Thermal Expansion Copper Molybdenum Heat Base Cu / MoCu / Cu ( CPC ) Sheet


High Thermal Expansion Molybdenum Copper Cu/MoCu/Cu(CPC) sheet


Description:

CPC is a sandwich composite, CMC including a molybdenum core layer and two copper clad layers, CPC including a Mo-Cu alloy core layer and two copper clad layers . They have different CTE in X and γ direction, with higher thermal conductivity than that of W (Mo)-Cu.

Advantages:
1.More easily to be stamped into components than CMC
2.Very strong interface bonding which can repeatedly resist 850℃ heat shock
3.Higher thermal conductivity and lower cost
4.No magnetism

Product Properties:
GradeDensity g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Coefficient of thermal

Expansion ×10-6 (20℃)

CPC1419.57.3

280(XY)/170(Z)

CPC2329.310.2255(XY)/250(Z)

Application:
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mount,mobile phone base stations.


Product picture:

Product Tags:

molybdenum element

  

mocu heat sink

  
Quality High Thermal Expansion Copper Molybdenum Heat Base Cu / MoCu / Cu ( CPC ) Sheet for sale
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