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Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip

Categories Molybdenum Copper
Brand Name: JBNR
Model Number: HCMC024
Certification: ISO9001
Place of Origin: China
MOQ: 10pcs
Price: Negotiable
Payment Terms: L/C, D/A, D/P, T/T, Western Union
Supply Ability: 5 tons a month
Delivery Time: 15-20 days
Packaging Details: Wooden boxes
Grade:: Mo85Cu15, Mo80Cu20, Mo75C25, Mo70Cu30, Mo60Cu40,Mo50Cu50
Surface:: Grinded or lathed
Dimensions:: Based on customer requirements
Plating:: Nickel plating or gold plaing
Shape:: Shims or sheets or fabricated parts
Other:: If required, we can offer silver plating
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Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip


Thermal Buffer Molybdenum Copper Substrate Welded To DBC On Chip


Description:

With adjustable thermal expansion coefficient and thermal conductivity, Molybdenum Copper Heat sink (MoCu) is a suitable material for heat cooling in microelectronic industry. And the density of molybdenum copper is equal or below 10.01 which is much smaller than that of tungsten copper.

For some specific industry like automobile and aerospace, Molybdenum Copper Heatsinks is a better choice.


Customers normally choose moly copper as heat sink and then they will weld DBC onto the heat sink.


Advantages:

1. high thermal conductivity and excellent hermeticity.

2. 40% lighter weight compared to WCu materials.



Product Properties:


GradeMo ContentDensity g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
85MoCu85±2%10.017200(25℃)/156(100℃)
80MoCu80±2%9.97170(25℃)/190(100℃)
70MoCu70±2%9.87.3200(25℃)/196(100℃)
60MoCu60±2%9.668.4222(25℃)/217(100℃)
50MoCu50±2%9.510.2250(25℃)/220(100℃)

Application:

Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.

Product Tags:

molybdenum element

  

mocu heat sink

  
Quality Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip for sale
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