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Alumnium Base Chip Led 50w , Outdoor Flood Lights High Power Led Chip

Categories Chip LED Cob
Brand Name: TYF
Model Number: M40-01L
Certification: CE,RoHs
Place of Origin: Shenzhen
MOQ: Negotiation
Price: Negotiable
Payment Terms: D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability: 1,000,000 PCS/day
Delivery Time: 5-7 days
Power: 50W
Chip material: Bridgelux
Type: COB LED
Application: COB LED grow lamp,led flood
Product name: COB LED
Lifespan: 50000hours
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Alumnium Base Chip Led 50w , Outdoor Flood Lights High Power Led Chip

50w alumnium base Outdoor flood lights high efficiency COB


1

• Efficacy of 128 lm/W typical for 3000K, 80CRI

• Compact high flux density light source

• Uniform, high quality illumination

• Minimum 70, 80, and 90 CRI options

• StreaCLined thermal path

• ENERGY STAR® / ANSI compliant color binning

structure with 2, 3 and 5 SDCM standard

• More energy efficient than incandescent, halogen

and fluorescent lamps

• High voltage or Low voltage DC operation

• Product series and company logo on the front

• RoHS compliant


The part number designation for TYF ML Series LED arrays is explained as follows:




Part Number

Typical Power (W)Nominal CCT (K)

CRI

Minimum Pulsed Flux (lm)Typical Pulsed Flux (lm)Typical Voltage (V)Nominal Current (mA)Typical Efficacy (lm/W)
CL36241216P430E*749.03000 K7072917840341440160
CL36241216P435E*749.03500 K7074287987341440163
CL36241216P440E*749.04000 K7075198085341440165
CL36241216P450E*749.05000 K7076108183341440167
CL36241216P457E*749.05700 K7077018281341440169
CL36241216P465E*749.06500 K7076108183341440167
CL36241216P422E*849.02200 K8060616517341440133
CL36241216P427E*849.02700 K8065177007341440143
CL36241216P430E*849.03000 K8068367350341440150
CL36241216P435E*849.03500 K8069277448341440152
CL36241216P440E*849.04000 K8070187546341440154
CL36241216P450E*849.05000 K8071547693341440157
CL36241216P457E*849.05700 K8071997742341440158
CL36241216P465E*849.06500 K8071547693341440157
CL36241216P422E*949.02200 K9051955586341440114
CL36241216P427E*949.02700 K9055605978341440122
CL36241216P430E*949.03000 K9058336272341440128
CL36241216P435E*949.03500 K9060156468341440132
CL36241216P440E*949.04000 K9060616517341440133
CL36241216P450E*949.05000 K9061066566341440134
CL36241216P457E*949.05700 K9061516615341440135



5.1 Color Binning Information


Figure 1: Graph of Test Bins in xy Color Space (Pulsed Test Conditions, Tj = 25°C)


CIE1931-x


Table 38: 2-Step to 5-step MacAdam ellipse color bin definitions for TYF CoB Core Range


Nominal

CCT

Center PointMAJOR AXIS (a , b)

Ellipse


Rotation Angel,θ

XY2-Step3-Step5-Step
2200K0.50180.4153(0.0048 , 0.0027)(0.0072, 0.0041)(0.0120, 0.0067)39.9
2500K0.48060.4141(0.0050, 0.0027)(0.0076, 0.0041)(0.0126, 0.0068)53.1
2700K0.45750.4101(0.0053, 0.0027)(0.0080, 0.0041)(0.0133, 0.0068)54.1
3000K0.43380.4030(0.0057, 0.0028)(0.0086, 0.0042)(0.0142, 0.0069)53.7
3500K0.40730.3917(0.0062, 0.0028)(0.0093, 0.0041)(0.0155, 0.0069)54.0
4000K0.38180.3797(0.0063, 0.0027)(0.0093, 0.0042)(0.0157, 0.0068)53.4
5000K0.34470.3553(0.0054, 0.0024)(0.0081, 0.0035)(0.0135, 0.0059)59.8
5700K0.32900.3417(0.0048, 0.0021)(0.0072, 0.0032)(0.0119, 0.0052)58.8
6500K0.31230.3282(0.0044, 0.0018)(0.0066, 0.0027)(0.0110, 0.0045)58.1


6.1 Table 39: Maximum Ratings


Notes for Table 39:

  • Driven the arrays at higher currents however lumen maintenance may be reduced.
  • Proper current derating must be observed to maintain junction temperature below the maximum
  • Pulsed operation with a peak drive current equal to the stated peak pulsed forward current is acceptable if the pulse on-time is ≤1ms per cycle and the duty cycle is ≤10%
  • Light emitting diodes are not designed to be driven in reverse voltage and will not produce light under this condition. Maximum rating provided for reference only.



Notes: 1. All dimension tolerance is ±0.2mm unless otherwise noted. 2. Tc measurement point at cathode



RECOMMENDED SOLDERING CONDITION

For manual soldering. Please use lead-free soldering and the soldering shall be implemented using a soldering bit at a

temperature lower than 350C, and shall be finished within 3.5 seconds for one land. No external force shall be applied

to resin part while soldering is implemented. Next process of soldering should be carried out after the product has

return to ambient temperature. CAUTION: TEMPERATURE CONTROL




Product Packing and Labeling


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led light chips

  
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