Sign In | Join Free | My frbiz.com
frbiz.com
Products
Search by Category
Home > Power Distribution Equipment >

Multilayer Copper Metal Substrate PCB Buried Resistance 1oz Copper Thickness 22L buried + buried high multilayer rigid f

Categories Metal Substrate PCB
Brand Name: China chao sheng
Model Number: 22L buried + buried high multilayer
Place of Origin: Shenzhen, Guangdong, China
MOQ: 1PCS
Price: Negotiation
Payment Terms: T/T, Western Union
Supply Ability: 5-200K/pcs per month
Delivery Time: 35-40day
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Certification: ISO/UL/RoHS/TS
Base material: FR-4
Surface finishing: ENIG,Gold plating
Min. line spacing: 1/2 oz. copper .003" +/- .0005" (0.0762mm)
Board thickness: 0.2mm-6.00 mm(8mil-126mil)
Min. line width: 1/2 oz. copper .003" +/- .0005" (0.0762mm)
Copper thickness: 1oz
Min. hole size: 0.25mm
Product name: Fr4 sheet
Application: Consumer Electronics
Number of layers: 1-32 Layers
Pcb assembly method: Mixed,BGA
Usage: Household Appliance etc.
Material: Teflon,Rogers
Electrical testing: Flying Probe Test
Bga ball pitch: 1mm ~ 3mm(4mil ~ 12mil)
Pcb test: Flying probe and AOI (Default)/Fixture Test
Hi-tg fr4 material: Tg-130 Tg-140 Tg-160 Tg-170
Pcb assembly test: AOI
Solder mask color: Green/Yellow/Black/White/Red/Blue
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
Submit Buying Request
  • Product Details
  • Company Profile

Multilayer Copper Metal Substrate PCB Buried Resistance 1oz Copper Thickness 22L buried + buried high multilayer rigid f

22L buried + buried high multilayer rigid flex pcb,Metal Substrate PCB,Buried, buried resistance PCB,pcb copper board


Product Description

  1. Product field: military system module
  2. Number of layers: 22L buried + buried high multilayer,impedance Ω±10%, Resin plug hole + copper fill hole
  3. Plate thickness: 6.5mm
  4. Process structure: FR-4, TG180+ deep digging recessed IC capacitor + resistor
  5. Surface treatment: immersion gold
  6. Packing: vacuum packaging + tin wrapped paper + desiccant + humidity card + carton
  7. Printed circuit board (pcb) and PCBA products
    Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
    Flexible circuit board (FPC) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

In order to provide you with the most efficient and accurate quote on manufacturing the requested unit, we ask that you provide us with the following information


1. Gerber file,PCB file,Eagle file or CAD file are all acceptable

2. A detailed bill of materials (BOM)

3. Clear pictures of PCB or PCBA sample for us

4. Quantity and delivery required

5. Test method for PCBA to guarantee 100% good quality products.

6. Schematics file for PCB design if need to do function test.

7. A sample if available for better sourcing

8. CAD files for enclosure manufacturing if required

9. A complete wiring and assembly drawing showing any special assembly instructions if required


PCB, FPC process production capability

Technical ltemMassProductAdvanced Technology
201620172018
Max.Layer Count26L36L80L
Through-hole plate2~45L2~60L2~80L
Max.PCBSize(in)24*52"25*62"25*78.75"
The layer number of FPC1~36L1~50L1~60L
Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
Layeredplatelayer2~12L2~18L2~26L
Max.PCBSize(in)9"*48"9"*52"9"*62"
Combination of hard and soft layers3~26L3~30L3~50L
Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
HDI PCB4~45L4~60L4~80L
Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
Max.PCBSize(in)24"*43"24"*49"25"*52"
MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
Build-up MaterialFR-4FR-4FR-4
BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
Min.18L(mm)0.632.0~8.00.51~10.0mm
Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
MAX(mm)3.510.0mm10.0mm
Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
Gold thick1~40u"1~60u"1~120u"
Nithick76~127u"76~200u"1~250u"
Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
DieletricThickness38(1.5)32(1.3)32(1.3)
125(5)125(5)125(5)
SKipviaYesYesYes
viaoNhie(laserviaon BuriedPTH)YesYesYes
Laser Hole FillingYesYesYes
TechnicalltemMass ProductAdvanced Technolgy
2017year2018year2019year
Drill hole depth ratioThroughHole2017year.40:1.40:1
Aspet RatioMicro Via.35:11.2:11.2:1
Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
BGAPitch mm(Mil)0.30.30.3
Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
Line Width Control∠2.5MIL±0.50±0.50±0.50
2.5Mil≤L/W∠4mil±0.50±0.50±0.50
≦3mil±0.60±0.60±0.60
Laminated structureLayer by layer3+N+34+N+45+N+5
Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
Multi-layer overlayN+NN+NN+N
N+X+NN+X+NN+X+N
sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
PTH filling processPTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

PCB, FPC product application field
Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products


Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray


FAQ:
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: How can I know the process of my PCB production?
A: 5-15days for PCB production and components purchasing, and 14-18 days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

Quality Multilayer Copper Metal Substrate PCB Buried Resistance 1oz Copper Thickness 22L buried + buried high multilayer rigid f for sale
Send your message to this supplier
 
*From:
*To: Shenzhen Chaosheng Electronic Technology Co.,Ltd
*Subject:
*Message:
Characters Remaining: (0/3000)
 
Inquiry Cart 0