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Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding

Categories Back Grinding Wheel
Brand Name: Hongtuo
Model Number: HT-BGW
Certification: ISO9001:2015
Place of Origin: China (Mainland)
MOQ: 2
Price: Price can be negotiated
Payment Terms: T/C,T/T
Supply Ability: 300/pcs per month
Delivery Time: 2-3weeks
Packaging Details: Carton Box
Name: Silicon Wafer Back Grinding Wheels
Applications: Semiconductor silicon
Space code: 6A2 or 14A1
Finishing: Nitride
Body: STEEL
Structure: With flange or without
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Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding


Back Grinding Wheel Silicon Wafer Back & Front Rough and Finish Grinding


Hongtuo, as a major designer, manufacturer and distributor of diamond and CBN grinding wheels, can offer an excellent selection of back grinding wheels. This particular grinding tool comes in two types: a silicon wafer back grinding wheel and an LED substrate back grinding wheel. Both of them can be used on different grinding machines made in Europe,America,Japan, and China. They also feature a stable performance and a high cost effectiveness.


Silicon Wafer Back Grinding Wheel


This abrasive wheel is primarily used for thinning and finishing semiconductor wafers. It comes with a superior grinding performance and a low coast. It can be used on grinding machines manufactured in Japan,Germany and China.


Grinding Objects: Discrete devices, IC substrate silicon wafers and original silicon wafers


Processes: Back to front rough and fine grinding


Application: Semiconductor silicon, Wafer Back & Front Rough and Finish Grinding.


Work Piece Materials: Monocrystalline silicon and other semiconductor materials.


Quality Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding for sale
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