Sign In | Join Free | My frbiz.com |
|
Categories | Back Grinding Wheel |
---|---|
Brand Name: | Hongtuo |
Model Number: | HT-BGW |
Certification: | ISO9001:2015 |
Place of Origin: | China (Mainland) |
MOQ: | 2 |
Price: | Price can be negotiated |
Payment Terms: | T/C,T/T |
Supply Ability: | 300/pcs per month |
Delivery Time: | 2-3weeks |
Packaging Details: | Carton Box |
Name: | Silicon Wafer Back Grinding Wheels |
Applications: | Semiconductor silicon |
Space code: | 6A2 or 14A1 |
Finishing: | Nitride |
Body: | STEEL |
Structure: | With flange or without |
Back Grinding Wheel Silicon Wafer Back & Front Rough and Finish Grinding
Hongtuo, as a major designer, manufacturer and distributor of diamond and CBN grinding wheels, can offer an excellent selection of back grinding wheels. This particular grinding tool comes in two types: a silicon wafer back grinding wheel and an LED substrate back grinding wheel. Both of them can be used on different grinding machines made in Europe,America,Japan, and China. They also feature a stable performance and a high cost effectiveness.
Silicon Wafer Back Grinding Wheel
This abrasive wheel is primarily used for thinning and finishing semiconductor wafers. It comes with a superior grinding performance and a low coast. It can be used on grinding machines manufactured in Japan,Germany and China.
Grinding Objects: Discrete devices, IC substrate silicon wafers and original silicon wafers
Processes: Back to front rough and fine grinding
Application: Semiconductor silicon, Wafer Back & Front Rough and Finish Grinding.
Work Piece Materials: Monocrystalline silicon and other semiconductor materials.
![]() |