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WCu MoCu CMC CPC Heat Sink Materials Excellent Flatness With Perfect Surface Finish

Categories Heat Sink
Brand Name: JBNR
Model Number: 50MoCu,60MoCu,70MoCu,85MoCu
Place of Origin: CHINA
Payment Terms: L/C, , T/T, Western Union
Delivery Time: 15days
Packaging Details: as customer required
MOQ: Negotiation
Price: Negotiable
Material: tungsten copper
Density: 16.4
CTE: 7.2
TC: 185
Application: Electronic Packaging
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WCu MoCu CMC CPC Heat Sink Materials Excellent Flatness With Perfect Surface Finish

WCu / MoCu / CMC / CPC Heat Sink Materials For Electronic Packaging


Description:


CuW heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape.


CuMo composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.


CMC or CPC is a sandwich composite, CMC including a molybdenum core layer and two copper clad layers, CPC including a Mo-Cu alloy core layer and two copper clad layers . They have different CTE in X and γ direction, with higher thermal conductivity than that of W (Mo)-Cu.


Advantages:


1. High thermal conductivity

2. Excellent hermeticity

3. Excellent flatness, surface finish, and size control

4. Semi-finished or finished (Ni/Au plated) products available

5. Low void


Product Properties:


GradeW ContentDensity g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
90WCu90±2%17.06.5180 (25℃) /176 (100℃)
85WCu85±2%16.47.2190 (25℃) / 183 (100℃)
80WCu80±2%15.658.3200 (25℃) / 197 (100℃)
75WCu75±2%14.99.0230 (25℃) / 220 (100℃)
50WCu50±2%12.212.5340 (25℃) / 310 (100℃)
GradeMo ContentDensity g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
85MoCu85±2%10.07160(25℃)/156(100℃)
70MoCu70±2%9.87200(25℃)/196(100℃)
60MoCu60±2%9.667.5222(25℃)/217(100℃)
50MoCu50±2%9.510.2250(25℃)/220(100℃)

GradeDensity g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Coefficient of thermal

Expansion ×10-6 (20℃)

CPC1419.57.3280(XY)/170(Z)
CPC2329.310.2255(XY)/250(Z)

Application:


These composite are widely used in applications such as Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.


Product picture:


Product Tags:

copper heat sink

  

copper base plate

  
Quality WCu MoCu CMC CPC Heat Sink Materials Excellent Flatness With Perfect Surface Finish for sale
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