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Cu/MoCu/Cu Copper Heat Spreader , High Performance Copper Heat Sink

Categories Hermetic Packages Electronics
Brand Name: JBNR
Model Number: CPC141,CPC232,CPC300
Place of Origin: CHINA
Payment Terms: L/C, , T/T, Western Union
Delivery Time: 15days
Packaging Details: as customer required
Material: copper/moly copper/copper
Density: 9.5
CTE: 7.3
TC: 170
MOQ: Negotiation
Price: Negotiable
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Cu/MoCu/Cu Copper Heat Spreader , High Performance Copper Heat Sink

Hermetic Packages Electronics Material Cu/MoCu/Cu High-Performance Heat Sink


Description:


Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper clad layers.The ratio of the thickness in Cu:Mo-Cu:Cu can be varied. It has higher thermal conductivity than that of W(Mo)-Cu, Cu/Mo/Cu and is cheaper, so comparable speaking, it has higher price-quality ratio.

Advantages:

1.More easily to be stamped into components than CMC
2.Very strong interface bonding which can repeatedly resist 850℃ heat shock
3.Higher thermal conductivity and lower cost
4.No magnetism

Product Properties:
GradeDensity g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Coefficient of thermal

Expansion ×10-6 (20℃)

CPC1419.57.3

280(XY)/170(Z)

CPC2329.310.2255(XY)/250(Z)

Application:


It can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.

Product picture:

Quality Cu/MoCu/Cu Copper Heat Spreader , High Performance Copper Heat Sink for sale
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