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Categories | Hermetic Packages Electronics |
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Brand Name: | JBNR |
Model Number: | CPC141,CPC232,CPC300 |
Place of Origin: | CHINA |
Payment Terms: | L/C, , T/T, Western Union |
Delivery Time: | 15days |
Packaging Details: | as customer required |
Material: | copper/moly copper/copper |
Density: | 9.5 |
CTE: | 7.3 |
TC: | 170 |
MOQ: | Negotiation |
Price: | Negotiable |
Hermetic Packages Electronics Material Cu/MoCu/Cu High-Performance
Heat Sink
Description:
Grade | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Coefficient of thermal Expansion ×10-6 (20℃) |
CPC141 | 9.5 | 7.3 | 280(XY)/170(Z) |
CPC232 | 9.3 | 10.2 | 255(XY)/250(Z) |
Application:
It can be used as thermal mounting plates, chip carriers for
microwave, flanges and frames for RF, laser diode packages, LED
packages, BGA packages and GaAs device mounts etc.
Product picture:
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