Sign In | Join Free | My frbiz.com
frbiz.com
Products
Search by Category
Home > Silicon Steel >

Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects

Categories High Frequency PCB
Brand Name: XCE
Model Number: XCE
Certification: CE/ROHS/SGS/MSDS/UL
Place of Origin: China
MOQ: 1pc
Price: negotiation
Supply Ability: 1000000pcs/month
Packaging Details: anti-static pacni
Material: Rogers series
Layer: 2-48layers
Smallest pad size: .001″ /size (.001″ / 0.025mm annular ring) 0.025mm annular ring
Smallest finished via: .004″ / 0.102mm
Inner layer pads: 025″ / 0.635mm oversize minimum
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
Submit Buying Request
  • Product Details
  • Company Profile

Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects

XCE specialize in manufacturing various hi-frequency PCB and multilayer board including fastest sample products. Provides you with a unique one stop solution to all your printed circuit needs, including PCB manufacturing and assembly.


Radar microwave circuit board (PCB) production,Doppler sensor module LED light board,5.8G,24G sensor board, speed electronic dog motherboard,Rogeros high frequency board,Taconic high frequency board, TP-2 special media board,Board,F4B domestic high-frequency board,Rogeros and FR4 mixing plate,4G antenna high frequency board,4G base station high frequency board.


Highlights:

Rigid PCB–2 Layer to 48 Layers

Blind/buried via

Backplane

High Density Interconnects (HDI)

Board thickness 8mm

Maximum copper thickness 8 oz


PCB surface finish:

HASL

Leadfree HASL

OSP

ENIG Immersion Gold

Immersion tin

Flash gold


Laminate Materials:

FR4 Normal and high-TG

Rogers

Taconic

Isola

F4B


Special requirements:

Peelable solder mask

Carbon ink

Buried capacitor/resistor


Quality Standard certifications:

ISO9001

QS9000

ISO14001

TS16949

AS9100

UL Underwriter Laboratories


IPC-600 Class 2Standard manufacturing specifications
IPC-600 Class 3Available as required
IPC-6012Available as required with in-house testing capabilities

Inner layer pads025″ / 0.635mm oversize minimum
Smallest finished via.004″ / 0.102mm
Standard pad size (.002″/ 0.051mm annular ring)0085″ / 0.216mm annular ring (.017″ / 0.432mm oversize)
Smallest pad size (.001″ / 0.025mm annular ring).0075″ / 0.191mm annular ring (.015″ / 0.038mm oversize)
Standard line and spacing.005″ / .005″ (0.127mm / 0.127mm)
Special line and spacing.003″ / .003″ (0.076mm / 0.076mm)
Quality Multilayer Immersion Gold High Frequency PCB Board Thickness 8mm High Density Interconnects for sale
Send your message to this supplier
 
*From:
*To: Shenzhen Xinchenger Electronic Co.,Ltd
*Subject:
*Message:
Characters Remaining: (0/3000)
 
Inquiry Cart 0