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RT/Duroid 5880 20mil 0.508mm Rogers High Frequency PCB for Radar Systems

Categories Arlon PCB Board
Brand Name: Bicheng Technologies Limited
Model Number: BIC-21-V3.29
Certification: UL
Place of Origin: China
MOQ: 1
Price: USD40~50
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
Delivery Time: 5-6 working days
Packaging Details: Vacuum
Board Material: Rogers 5880
Board Thickness: 0.60 mm +/-0.06
Surface Cu thickness: 35 um (1 oz)
Surface Finish: Immersion Gold
Solder Mask Colour: NA
Color of Silkscreen: NA
Function: 100% Pass electrical test
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RT/Duroid 5880 20mil 0.508mm Rogers High Frequency PCB for Radar Systems

RT/Duroid 5880 20mil 0.508mm Rogers High Frequency PCB for Radar Systems

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Rogers RT/duroid 5880 high frequency material is glass microfiber reinforced PTFE composites which is designed for exacting stripline and microstrip circuit applications. The exceptional dielectric constant uniformity results from its randomly oriented microfibers. The dielectric constant of RT/duroid 5880 is uniform from panel to panel and is constant over a wide frequency range. Its low dissipation factor extends the usefulness of RT/duroid 5880 to Ku-band and above. RT/duroid 5880 materials are easily cut, sheared and machined to shape. They are resistant to all solvents and reagents, hot or cold, normally used in etching printed circuits or in plating edges and holes.


The typical applications are commercial airline broadband antennas, microstrip circuits, stripline circuits, millimeter wave applications, military radar systems, missile guidance systems and point to point digital radio antennas etc.



General description

This is a type of double sided RF PCB built on RT/duroid 5880 for the application of Radar Systems.


Basic specifications

Base material: RT/duroid 5880 20mil (0.508mm)

Dielectric constant: 2.20+/-0.02

Layer count: 2 layers

Type: Through holes

Format: 128mm x 62mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm

Solder mask | Legend: No | No

Final PCB height: 0.52 mm

Standard: IPC 6012 Class 2

Packing: 20 panels are packed for shipment.

Lead time: 7 working days

Shelf life: 6 months


Applications

Commercial Airline Broadband Antennas, Microstrip and Stripline Circuits, Millimeter Wave Applications, Military Radar Systems, Missile Guidance Systems, Point to Point Digital Radio Antennas.


Data sheet of Rogers RT/duroid 5880

RT/duroid 5880 Typical Value
PropertyRT/duroid 5880DirectionUnitsConditionTest Method
Dielectric Constant,εProcess2.20
2.20±0.02 spec.
ZN/AC24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign2.2ZN/A8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.0004
0.0009
ZN/AC24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε-125Zppm/-50to 150IPC-TM-650 2.5.5.5
Volume Resistivity2 x 107ZMohm cmC/96/35/90ASTM D 257
Surface Resistivity3 x 107ZMohmC/96/35/90ASTM D 257
Specific Heat0.96(0.23)N/Aj/g/k
(cal/g/c)
N/ACalculated
Tensile ModulusTest at 23Test at 100N/AMPa(kpsi)AASTM D 638
1070(156)450(65)X
860(125)380(55)Y
Ultimate Stress29(4.2)20(2.9)X
27(3.9)18(2.6)Y
Ultimate Strain67.2X%
4.95.8Y
Compressive Modulus710(103)500(73)XMPa(kpsi)AASTM D 695
710(103)500(73)Y
940(136)670(97)Z
Ultimate Stress27(3.9)22(3.2)X
29(5.3)21(3.1)Y
52(7.5)43(6.3)Z
Ultimate Strain8.58.4X%
7.77.8Y
12.517.6Z
Moisture Absorption0.02N/A%0.62"(1.6mm) D48/50ASTM D 570
Thermal Conductivity0.2ZW/m/k80ASTM C 518
Coefficient of Thermal Expansion31
48
237
X
Y
Z
ppm/0-100IPC-TM-650 2.4.41
Td500N/A TGAN/AASTM D 3850
Density2.2N/Agm/cm3N/AASTM D 792
Copper Peel31.2(5.5)N/APli(N/mm)1oz(35mm)EDC foil
after solder float
IPC-TM-650 2.4.8
FlammabilityV-0N/AN/AN/AUL 94
Lead-free Process CompatibleYesN/AN/AN/AN/A

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