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Metal Core PCB Built On Aluminum Base With Black Solder Mask

Categories FR-4 PCB Board
Brand Name: Bicheng Enterprise Limited
Model Number: BIC-0574-V5.74
Certification: China
Place of Origin: China
MOQ: 1
Price: USD20~30
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
Delivery Time: 5-6 working days
Packaging Details: 5-6 working days
Aluminum core: 1W / MK dielectric material 75um
Final height of PCB: 1.6mm ±0.16
Final foil external: 1oz
Surface Finish: Hot air soldering leveling(HASL),lead free, Sn>=2.54µm
Solder Mask Color: Black, KSM-S6189BK31
Colour of Component Legend: White, IJR-4000 MW300
TEST: 100% Electrical Test prior shipment
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  • Product Details
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Metal Core PCB Built On Aluminum Base With Black Solder Mask

General Profile


Metal core PCB is thermal management circuit board used in LED lighting which

needs fast cooling dissipation. The metal core can be aluminum (aluminum core

PCB) and copper (copper core PCB), even iron base. The fastest speed of heat

transfer is on copper which is designed in the form of thermoelectric separation.


Advantages


1) Effective heat dissipation reduces the operating temperature of the module

and prolongs the service life;
2) Power density and reliability are improved up 10%;
3) Reduce the dependence of heat sinks and other hardware (including thermal

interface materials);
4) Reduce the volume of the product;
5) Reduce the cost of hardware and assembly;
6) Optimization combination of power circuit and control circuit;
7) Replace the fragile ceramic substrate and obtain a better mechanical durability;
8) Reduce the operating temperature of the equipment;


Applications


LED lighting, Switch regulator, DC/AC converter, Communication electronic

equipment, A filter electric circuit, Office automation equipment, Motor driver,

Motor controller, Automobile etc.


Metal Core PCB Capability

NO.ParameterValue
1Type of Metal CoreAluminum, Copper, Iron
2Model of Metal CoreA1100, A5052, A6061, A6063, C1100
3Surface Finish

HASL, Immersion Gold, Immersion Silver,

OSP

4Thickness of Surface plating

HASL: Sn>2.54µm, ENIG:

Au 0.025-0.1µm, Ni 2.5-5µm

5Layer Count1-4 Layers
6Maximum of Board Size23" x 46" (584mm×1168mm)
7Mininum of Board Size0.1969" x 0.1969" (5mm×5mm)
8Board Thickness0.0157" x 0.2362" (0.4-6.0mm)
9Copper Thickness

0.5OZ(17.5µm),1OZ(35µm),2OZ(70µm),

3OZ(105µm),

4OZ(140µm) to 10oz (350µm)

10Minimum Track Width5mil (0.127mm)
11Minimum Space5mil (0.127mm)
12Minimum Hole Size0.0197" (0.5mm)
13Maximum Hole SizeNo limit
14Minimum Holes PunchedPCB thickness <1.0mm: 0.0394" (1.0mm)
PCB thikness 1.2-3.0mm: 0.0591" (1.5mm)
15PTH Wall Thickness>20µm
16Tolerance of PTH±0.00295" (0.075mm)
17Tolerance of NPTH±0.00197" (0.05mm)
18Deviation of Hole Position±0.00394" (0.10mm)
19Outline ToleranceRouting: ±0.00394" (0.1mm)
Punching: ±0.00591" (0.15mm)
20Angle of V-cut30°, 45°, 60°
21V-cut Size0.1969" x 47.24" (5mm×1200mm)
22Thickness of V-cut Board0.0236" x 0.1181" (0.6-3mm)
23Tolerance of V-cut Angle±5º
24V-CUT Verticality≤0.0059" (0.15mm)
25Minimum Square Slots Punched

PCB thickness < 1.0mm:

0.0315" x 0.0315" (0.8 x 0.8mm)

PCB thickness 1.2-3.0mm: 0.0394" x 0.0394" (1.0 x 1.0mm)
26Minimum BGA PAD0.01378" (0.35mm)
27Minimum Width of Solder Mask Bridge.8mil (0.2032mm)
28

Minimum Thickness of

Solder Mask

>13µm (0.013mm)
29Insulation Resistance1012ΩNormal
30Peel-off Strength2.2N/mm
31Solder float260℃ 3min
32E-test Voltage50-250V
33Thermal Conductivity0.8-8W/M.K
34Warp or Twist≤0.5%
35FlammabilityFV-0
36Minimum Height of Component indicator0.0059"(0.15mm)
37

Minimum Open Solder

Mask on Pad

0.000394" (0.01mm)

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