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One Component Room Temperature Cured Thermally Conductive Silicone Adhesive For LED Lamps And Power-Driven Potting

Categories Thermal Conductive Adhesive
Brand Name: ziitek
Model Number: TIS580-10
Certification: RoHs
Place of Origin: China
MOQ: 25PC
Supply Ability: 1000PC/Day
Delivery Time: 2-3 work days
Packaging Details: 100ml / pc, 100pc / box; 300ml / pc, 24pc / box
Name: One Component Room Temperature Cured Thermally Conductive Silicone Adhesive For LED Lamps And Power-Driven Potting
Keywords: Thermally Conductive Adhesive
Appliaction: LED Lamps And Power-driven Potting
Total cure time(d, 25℃): 3-7
Tack-free time(min,25℃): ≤20
Thermal Conductivity (W/m·K): 1.0
Density(g/cm³,25℃): 1.3
Appearance: White paste
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One Component Room Temperature Cured Thermally Conductive Silicone Adhesive For LED Lamps And Power-Driven Potting

One Component Room Temperature Cured Thermally Conductive Silicone Adhesive For LED Lamps And Power-Driven Potting

TIS™580-10 Series is dealcoholized,one component, room temperature cure thermally conductive silicone adhesive. lt possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance.Thus, heat transfer among heat source, heat-sink, motherboard,metal casing will become effective.


TIS™580-10 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use.TIS™580-10 Series has excellent adhesion to copper, aluminium, stainless-steel,etc.As this is a dealcoholized system, it will not corrode, especially, metalsurfaces.


TIS580-10.pdf


Feature


> Good thermal conductive: 1.0W/mK

> Excellent maneuverability and good adhesion

> Low shrinkage
> Low viscosity, Leads to void-free surface

> Good solvent resistance ,water resistance

> Long working life

> Excellent thermal shock resistance


Application
It mainly used in substituting thermally-conductive paste and pads, which currently finds in gap-filling adhesives or heat conduction between LED aluminium motherboard and heat sink, high power electrical module and heat sink. Traditional methods such as fins and screws fixing can be replaced by applying TIS580-10, resulting a more reliable gap-filling thermal conduction, simplified handling and more cost-effective.E.g. Massive application in integrated circuits in portable computer, microprocessor, high power LED, internal storage module, cache, integrated circuits, DC/AC translator, IGBT and other power modules, encapsulation of semi-conductors, relay switches, rectifiers and transfomers
Typical values of TISTM580-10
AppearanceWhite pasteTest Method
Density(g/cm3,25℃)1.3ASTM D297
Tack-free time(min,25℃)≤20*****
Cure type(1-component)Dealcoholized*****
Viscosity@25℃ Brookfield (Uncured)30K cpsASTM D1084
Total cure time(d, 25℃)3-7*****
Elongation(%)≥200ASTM D412
Hardness(Shore A)45ASTM D2240
Lap Shear Strength(MPa)≥2.5ASTM D1876
Peel Strength(N/mm)>5ASTM D1876
Operation temperature(℃)-60~250*****
Volume Resistivity(Ω·cm)2.0×1016ASTM D257
Dielectric Strength(KV/mm)21ASTM D149
Dielectric Constant (1.2MHz)2.9ASTM D150
Thermal Conductivity W/(m·K)1.0ASTM D5470
Flame RetardancyUL94 V-0E331100

Packing:
100ml /pc,100pc / box; 300ml / pc, 24pc / box


Storage and transportation:
1.Store in cool, dry place. Shelf life: 6 months (25℃)
2.This product is non-hazardous, refers to local general chemical transportation reg



Company profile


With professional R&D capabilities and over 18 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.


Certifications:


ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Independent R&D team


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