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2 Component Thermal Conductive Silicone Potting Compound Adhesive Liquid Gel

Categories Silicone Potting Compound
Brand Name: Hanast
Model Number: HN-8806AB
Certification: MSDS
Place of Origin: CHINA
MOQ: 1KG
Price: 4.6
Payment Terms: T/T
Supply Ability: 1000000KG
Delivery Time: 3-7 work days
Packaging Details: Plastic/Iron Drums
Product name: Silicone potting glue
Color: Black/White/Transparent color, can customized
Application: PCB/Battery/LED
Package: 5kgs/25kgs/200kgs/bag
Material: Silicone&Agent
Keywords: Waterproof Sealant
Viscosity: Excellent Viscosity
Certificate: MSDS RoHS UL
Feature: Low and high Temperature Resistance
Thermal conductivity: Customize
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2 Component Thermal Conductive Silicone Potting Compound Adhesive Liquid Gel

Rtv Silicone Two Component Thermal Conductive Adhesive Waterproof Low Viscosity Waterproof Sealing High Moisture Resistance Glue

HN-8806 Two-Component Addition-Type Silicone Potting Rubber


Product Specification

Test ItemsTest StandardUnitsProduct test results
Part APart B
Before curing1Appearance------Grey, fluidWhite, fluid
2ViscosityGB/T10247-200825ºC, mPa·S4500~50004500~5000
3DensityGB/T 13354-9225ºC, g/cm³1.50±0.051.50±0.05
4Mixing Ratio (A : B)1:01Weight ratio100100
Volume ratio100100
5Operating timeMeasuredhr0.3-0.4
6Curing conditionMeasuredhr4^12 (25ºC,initial cure)
0.20 (80ºC)
After
Curing
7Appearance------Grey elastomer
8HardnessGB/T 531.1-2008Shore A50±5
9Thermal conductivityGB/T10297-1998w/m·k≥0.76
10ExpansivityGB/T20673-2006μm/(m,ºC)210
11Moisture AbsorptionGB/T 8810-200524h,25ºC, %0.01~0.02
12Volume resistivityGB/T 1692-92(DC500V),Ω · cm1.0×10¹⁵
13Dielectric intensityGB/T 1693-2007Kv/mm(25ºC)18^25
14Temperature ResistanceMeasuredºC-50~+250°c

Product Advantages

High-Performance Elastomer: Forms a high-elasticity, high-strength protective layer after curing.

Low Viscosity: Suitable for deep-section potting, ensuring even distribution.

No By-Products: No heat or by-products are emitted during curing, ensuring component safety.

Flame Retardant: Passes UL-94 flame retardancy tests, ensuring safety in high-temperature environments.

Eco-Friendly Certification: Complies with RoHS standards, non-polluting.

Applications

Potting and sealing of power modules, circuit boards, and high-voltage transformers.

Protection and thermal management for battery packs and fast-charging adapters.

Moisture-proof and waterproof protection for LED outdoor drive power supplies.

Other electronic components requiring vibration, water, and thermal protection.

Application Method

1.Mix components A and B in a 1:1 ratio, stir thoroughly, and then proceed with potting.

2.Ensure the surface of the components is clean before potting. For large products, pot in stages.

3.For automated production lines, vacuum components A and B separately to ensure accurate mixing ratio.

Technical Parameters


Appearance: Part A – Grey fluid; Part B – White fluid

Viscosity: 4500~5000 mPa·S

Density: 1.50±0.05 g/cm³

Mixing Ratio (A:B): 1:1

Pot Life: 0.3-0.4 hours

Curing Conditions: 4-12 hours at room temperature (initial cure), 0.2 hours at 80°C

Hardness: 50±5 Shore A

Thermal Conductivity: ≥0.76 W/m·K

Volume Resistivity: 1.0×10¹⁵ Ω·cm

Temperature Resistance: -50°C to +250°C


Packaging
10KG/Set (A 5kg + B 5kg)
20KG/Set (A 10kg + B 10kg)
50KG/Set (A 25kg + B 25kg)


Precautions

Stir components A and B separately before use to ensure even mixing.

Avoid contact with substances containing tin, sulfur, or amines to prevent curing inhibition.

Maintain cleanliness during use to prevent contamination.

   
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