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F4BME220 High Frequency PCB PTFE DK2.2 Dual Layer Cheap RF PWB for Couplers
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Brief Introduction
This PCB features a size of 100 x 100 mm and is designed as a double-sided board with two layers. It supports surface mount components while excluding through-hole components. The layer stackup consists of a top layer made of 35 µm (1 oz) copper starting with 0.5oz plating, paired with a robust F4BME220 core material of 1.0 mm thickness, and a matching 35 µm (1 oz) copper bottom layer. The surface finish is OSP (Organic Solderability Preservative), ensuring reliable soldering performance. Notably, this PCB does not have a solder mask applied.
Here are the details in table below.
PCB Specifications
| PCB SIZE | 100 x 100mm=1PCS |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 35um(0.5 oz +plate) TOP layer |
| F4BME220 1.0mm | |
| copper ------- 35um(0.5 oz + plate) BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 10 mil / 10 mil |
| Minimum / Maximum Holes: | 0.4 mm / 0.4 mm |
| Number of Different Holes: | 1 |
| Number of Drill Holes: | 1 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | F4BME220 DK 2.2 |
| Final foil external: | 1oz |
| Final foil internal: | N/A |
| Final height of PCB: | 1.1 mm ±10% |
| PLATING AND COATING | |
| Surface Finish | OSP |
| Solder Mask Apply To: | no |
| Solder Mask Color: | no |
| Solder Mask Type: | no |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | NO |
| Colour of Component Legend | NO |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Non-Plated through hole(PTH), minimum size 0.4mm. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
F4BME High Frequency Laminates
F4BME series laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is improved compared to F4B, mainly due to a wider range of dielectric constants, lower dielectric loss, increased insulation resistance, and improved stability. It can replace similar foreign products.
Features
◆ DK2.17 ～ 3.0 is optional, and DK can be customized
◆ Low loss
◆ F4BME with RTF copper foil has excellent PIM index
◆ Diversified size and cost saving
◆ Irradiation resistance and low exhaust
◆ Commercialization, mass production and high cost performance
Typical Applications
◆ Microwave, RF, radar
◆ Phase shifter, passive components
◆ Power divider, coupler and combiner
◆ Feed network, phased array antenna
◆ Satellite communication, base station antenna
Our PCB Capability(F4BME)
| PCB Material: | PTFE glass fiber cloth copper clad laminates | ||
| Designation (F4BME ) | F4BME | DK (10GHz) | DF (10 GHz) |
| F4BME217 | 2.17±0.04 | 0.0010 | |
| F4BME220 | 2.20±0.04 | 0.0010 | |
| F4BME233 | 2.33±0.04 | 0.0011 | |
| F4BME245 | 2.45±0.05 | 0.0012 | |
| F4BME255 | 2.55±0.05 | 0.0013 | |
| F4BME265 | 2.65±0.05 | 0.0013 | |
| F4BME275 | 2.75±0.05 | 0.0015 | |
| F4BME294 | 2.94±0.06 | 0.0016 | |
| F4BME300 | 3.00±0.06 | 0.0017 | |
| Layer count: | Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB | ||
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) | ||
| Dielectric thickness (or overall thickness) | 0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm | ||
| PCB size: | ≤400mm X 500mm | ||
| Solder mask: | Green, Black, Blue, Yellow, Red etc. | ||
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. | ||
Data Sheets (F4BME)
| Product Technical Parameters | Product Model & Data Sheet | |||||||||||
| Product Features | Test Conditions | Unit | F4BME217 | F4BME220 | F4BME233 | F4BME245 | F4BME255 | F4BME265 | F4BME275 | F4BME294 | F4BME300 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.17 | 2.2 | 2.33 | 2.45 | 2.55 | 2.65 | 2.75 | 2.94 | 3.0 | |
| Dielectric Constant Tolerance | / | / | ±0.04 | ±0.04 | ±0.04 | ±0.05 | ±0.05 | ±0.05 | ±0.05 | ±0.06 | ±0.06 | |
| Loss Tangent (Typical) | 10GHz | / | 0.001 | 0.001 | 0.0011 | 0.0012 | 0.0013 | 0.0013 | 0.0015 | 0.0016 | 0.0017 | |
| 20GHz | / | 0.0014 | 0.0014 | 0.0015 | 0.0017 | 0.0018 | 0.0019 | 0.0021 | 0.0023 | 0.0025 | ||
| Dielectric Constant Temperature Coefficient | -55ºC～150ºC | PPM/℃ | -150 | -142 | -130 | -120 | -110 | -100 | -92 | -85 | -80 | |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | |
| 1 OZ F4BME | N/mm | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >23 | >23 | >23 | >25 | >25 | >25 | >28 | >30 | >30 | |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >30 | >30 | >32 | >32 | >34 | >34 | >35 | >36 | >36 | |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 25, 34 | 25, 34 | 22, 30 | 20, 25 | 16, 21 | 14, 17 | 14, 16 | 12, 15 | 12, 15 |
| Z direction | -55 º~288ºC | ppm/ºC | 240 | 240 | 205 | 187 | 173 | 142 | 112 | 98 | 95 | |
| Thermal Stress | 260℃, 10s,3 times | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | |
| Density | Room Temperature | g/cm3 | 2.17 | 2.18 | 2.20 | 2.22 | 2.25 | 2.25 | 2.28 | 2.29 | 2.29 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.24 | 0.24 | 0.28 | 0.30 | 0.33 | 0.36 | 0.38 | 0.41 | 0.42 | |
| PIM | Only applicable to F4BME | dBc | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | |
| Flammability | / | UL-94 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | |
| Material Composition | / | / | PTFE, Fiberglass Cloth F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil. | |||||||||
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