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F4BME220 High Frequency PCB PTFE DK2.2 Dual Layer Cheap RF PWB for Couplers

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F4BME220 High Frequency PCB PTFE DK2.2 Dual Layer Cheap RF PWB for Couplers

F4BME220 High Frequency PCB PTFE DK2.2 Dual Layer Cheap RF PWB for Couplers

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Brief Introduction

This PCB features a size of 100 x 100 mm and is designed as a double-sided board with two layers. It supports surface mount components while excluding through-hole components. The layer stackup consists of a top layer made of 35 µm (1 oz) copper starting with 0.5oz plating, paired with a robust F4BME220 core material of 1.0 mm thickness, and a matching 35 µm (1 oz) copper bottom layer. The surface finish is OSP (Organic Solderability Preservative), ensuring reliable soldering performance. Notably, this PCB does not have a solder mask applied.


Here are the details in table below.


PCB Specifications

PCB SIZE100 x 100mm=1PCS
BOARD TYPEDouble sided PCB
Number of Layers2 layers
Surface Mount ComponentsYES
Through Hole ComponentsNO
LAYER STACKUPcopper ------- 35um(0.5 oz +plate) TOP layer
F4BME220 1.0mm
copper ------- 35um(0.5 oz + plate) BOT Layer
TECHNOLOGY
Minimum Trace and Space:10 mil / 10 mil
Minimum / Maximum Holes:0.4 mm / 0.4 mm
Number of Different Holes:1
Number of Drill Holes:1
Number of Milled Slots:0
Number of Internal Cutouts:0
Impedance Control:no
Number of Gold finger:0
BOARD MATERIAL
Glass Epoxy:F4BME220 DK 2.2
Final foil external:1oz
Final foil internal:N/A
Final height of PCB:1.1 mm ±10%
PLATING AND COATING
Surface FinishOSP
Solder Mask Apply To:no
Solder Mask Color:no
Solder Mask Type:no
CONTOUR/CUTTINGRouting
MARKING
Side of Component LegendNO
Colour of Component LegendNO
Manufacturer Name or Logo:Marked on the board in a conductor and leged FREE AREA
VIANon-Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:0.0059"
Board plating:0.0029"
Drill tolerance:0.002"
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.


F4BME High Frequency Laminates

F4BME series laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is improved compared to F4B, mainly due to a wider range of dielectric constants, lower dielectric loss, increased insulation resistance, and improved stability. It can replace similar foreign products.


Features

◆ DK2.17 ~ 3.0 is optional, and DK can be customized

◆ Low loss

◆ F4BME with RTF copper foil has excellent PIM index

◆ Diversified size and cost saving

◆ Irradiation resistance and low exhaust

◆ Commercialization, mass production and high cost performance


Typical Applications

◆ Microwave, RF, radar

◆ Phase shifter, passive components

◆ Power divider, coupler and combiner

◆ Feed network, phased array antenna

◆ Satellite communication, base station antenna


Our PCB Capability(F4BME)

PCB Material:PTFE glass fiber cloth copper clad laminates
Designation (F4BME )F4BMEDK (10GHz)DF (10 GHz)
F4BME2172.17±0.040.0010
F4BME2202.20±0.040.0010
F4BME2332.33±0.040.0011
F4BME2452.45±0.050.0012
F4BME2552.55±0.050.0013
F4BME2652.65±0.050.0013
F4BME2752.75±0.050.0015
F4BME2942.94±0.060.0016
F4BME3003.00±0.060.0017
Layer count:Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (or overall thickness)0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..


Data Sheets (F4BME)

Product Technical ParametersProduct Model & Data Sheet
Product FeaturesTest ConditionsUnitF4BME217F4BME220F4BME233F4BME245F4BME255F4BME265F4BME275F4BME294F4BME300
Dielectric Constant (Typical)10GHz/2.172.22.332.452.552.652.752.943.0
Dielectric Constant Tolerance//±0.04±0.04±0.04±0.05±0.05±0.05±0.05±0.06±0.06
Loss Tangent (Typical)10GHz/0.0010.0010.00110.00120.00130.00130.00150.00160.0017
20GHz/0.00140.00140.00150.00170.00180.00190.00210.00230.0025
Dielectric Constant Temperature Coefficient-55ºC~150ºCPPM/℃-150-142-130-120-110-100-92-85-80
Peel Strength1 OZ F4BMN/mm>1.8>1.8>1.8>1.8>1.8>1.8>1.8>1.8>1.8
1 OZ F4BMEN/mm>1.6>1.6>1.6>1.6>1.6>1.6>1.6>1.6>1.6
Volume ResistivityStandard ConditionMΩ.cm≥6×10^6≥6×10^6≥6×10^6≥6×10^6≥6×10^6≥6×10^6≥6×10^6≥6×10^6≥6×10^6
Surface ResistivityStandard Condition≥1×10^6≥1×10^6≥1×10^6≥1×10^6≥1×10^6≥1×10^6≥1×10^6≥1×10^6≥1×10^6
Electrical Strength (Z direction)5KW,500V/sKV/mm>23>23>23>25>25>25>28>30>30
Breakdown Voltage (XY direction)5KW,500V/sKV>30>30>32>32>34>34>35>36>36
Coefficientof Thermal ExpansionXY direction-55 º~288ºCppm/ºC25, 3425, 3422, 3020, 2516, 2114, 1714, 1612, 1512, 15
Z direction-55 º~288ºCppm/ºC2402402051871731421129895
Thermal Stress260℃, 10s,3 timesNo delaminationNo delaminationNo delaminationNo delaminationNo delaminationNo delaminationNo delaminationNo delaminationNo delamination
Water Absorption20±2℃, 24 hours%≤0.08≤0.08≤0.08≤0.08≤0.08≤0.08≤0.08≤0.08≤0.08
DensityRoom Temperatureg/cm32.172.182.202.222.252.252.282.292.29
Long-Term Operating TemperatureHigh-Low Temperature Chamber-55~+260-55~+260-55~+260-55~+260-55~+260-55~+260-55~+260-55~+260-55~+260
Thermal ConductivityZ directionW/(M.K)0.240.240.280.300.330.360.380.410.42
PIMOnly applicable to F4BMEdBc≤-159≤-159≤-159≤-159≤-159≤-159≤-159≤-159≤-159
Flammability/UL-94V-0V-0V-0V-0V-0V-0V-0V-0V-0
Material Composition//PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.

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