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Specific Gravity 2.7g/Cc CPU Thermal Gap Pad 1.5mm

Categories Thermal Gap Pad
Brand Name: ZIITEK
Model Number: TIF160-20-10UF thermal pad
Certification: UL and RoHs
Place of Origin: China
MOQ: 1000pcs
Price: negotiation
Supply Ability: 100000pcs/day
Delivery Time: 3-5 work days
Packaging Details: 1000pcs/bag
keyword: thermal gap pad
Dielectric Constant: 4.6 MHz
name: Specific Gravity 2.7 g/cc Outstanding Thermal Performance Conductive Pads for CPU
Volume Resistivity: 1.0X1012 Ohm-cm
Fire rating: 94 V0
Thickness: 1.5mmT
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Specific Gravity 2.7g/Cc CPU Thermal Gap Pad 1.5mm

Specific Gravity 2.7 g/cc Outstanding Thermal Performance Conductive Pads for CPU


The TIF160-20-10UF use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.


TIF100-20-10UF-Datasheet-REV02.pdf


Features

> Good thermal conductive: 2.0 W/mK

>Thickness: 1.5mmT

>hardness:75 shore 00

>Colour: Gray

>Moldability for complex parts
>Outstanding thermal performance
>High tack surface reduces contact resistance


Applications

>Automotive engine control units

>Telecommunication hardware

>Handheld portable electronics

>Semiconductor automated test equipment (ATE)

>CPU

>display card


Typical Properties of TIF160-20-10UF Series
Color
gray
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

2.7 g/cc

ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
1.5mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness

75 Shore 00

ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgasing (TML)
0.35%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant

4.6 MHz

ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
2.0 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470


Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.


Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated



FAQ:

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

Q:Do big buyers have promotional prices?

A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.

Quality Specific Gravity 2.7g/Cc CPU Thermal Gap Pad 1.5mm for sale
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