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Specific Gravity 2.2 G/Cc Thermal Gap Pad Silicone Soft Compressible

Categories Thermal Gap Pad
Brand Name: ZIITEK
Model Number: TIF160-10UF
Certification: UL and RoHs
Place of Origin: China
MOQ: 1000pcs
Price: negotiation
Supply Ability: 100000pcs/day
Delivery Time: 3-5 work days
Packaging Details: 1000pcs/bag
Feature: RoHS compliant
keyword: Thermal Gap Pad
Application: Monitoring the Power Box
name: Specific Gravity 2.2 g/cc Silicone Pads Soft and Compressible for Low Stress Applications for CPU
Specific gravity: 2.2 g/cc
color: gray
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Specific Gravity 2.2 G/Cc Thermal Gap Pad Silicone Soft Compressible


Specific Gravity 2.2 g/cc Silicone Pads Soft and Compressible for Low Stress Applications for CPU


The TIF160-10UF use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.


TIF100-10UF Datasheet-REV02.pdf


Features

> Good thermal conductive: 1.5 W/mK

>Thickness: 1.5mmT

>hardness:75 shore 00

>Colour: gray

>Good thermal conductive
>Moldability for complex parts
>Soft and compressible for low stress applications


Applications

>LED Power Supply

>LED Controller

>LED Ceilinglamp

>Monitoring the Power Box

>AD-DC Power Adapters

>Rainproof LED Power


Typical Properties of TIF160-10UF Series
Color
gray
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

2.2 g/cc

ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
1.5mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness

75 Shore 00

ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgasing (TML)
0.35%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant

3.9 MHz

ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
1.5 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470


Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.


Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated



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