High Speed Stencil Cleaning New Multi-Function Interface High-End Solder Paste Printing Machine

Categories	Solder Paste Machine
Brand Name:	HSTECH
Model Number:	HS-G9+
Certification:	CE
Place of Origin:	China
MOQ:	1 set
Price:	Negotiable
Payment Terms:	T/T, Western Union, MoneyGram
Supply Ability:	100 sets per month
Delivery Time:	7~9 work days
Packaging Details:	Wooden package
Product Name:	High-end Solder Paste Printing Machine
Warranty:	1 Year
Control:	Touch screen
Relay Brand:	Schneider
Optoelectronic Switch:	OMRON
Material:	Aluminum Alloy
Condition:	New
Signal:	SMEMA
Application:	Electronic Assembly
Color:	Silver
Control System:	PLC
OEM/ODM:	Available
Power Consumption:	200W
Type:	Automatic

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Company Info.

Shenzhen Hansome Technology Co., Ltd.

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High Speed Stencil Cleaning New Multi-Function Interface High-End Solder Paste Printing Machine

High Speed Stencil Cleaning New Multi-Function Interface High-End Solder Paste Printing Machine

Introduction

The G9+ Automatic solder paste printing machine is a high-end machine for SMT high-end application, the width of GT++ BTB is only 2830mm, can perfectly satisfy the printing process requirement of 03015,2025 pitch, high precision and high speed.

Features

1, CCD digital system, total new optical path system, uniform circular light and high brightness of coaxial light source. With both light source system, brightness can adjust to an infinite loop, allowing different mart point can be easily recognize (including uneven mark point) such as tin plating, copper plating, silver plating, hot air soldering, FPC and various types of different PCB color.

2, High precision PCB thickness adjustment, extremely reliable structure with stable XY movement. Manual adjustment makes it a breeze to accommodate different PCB thickness.

3,Guide rail positioning system, new Pattern guide rail ban detachable, programmable flexible side clamp, specific to FPC, PCB warpage, perform a unique clamping plate device. Through software programming can automatically stretch out and draw back unaffected PCB pickness.

4, New innovative squeegee structure design, adopt a comprehensive squeegee system which enhances stability and long lifespan.

5, High speed stencil cleaning, downward dispensing cleaning structure successfully prevents clogged opening(which is always the root cause for ineffective cleaning) from taking place. The length of solvent dispensedcan also be easilyamended with software control.

6, New multi-function interface, simplicity , clearly understand, friendly user. Actual temperature and humidity monitor function.

Specification

Model	G9+
Max PCB Size	450x340mm
Min PCB size	50x50mm
PCB thickness	0.4-6mm
Max board weight	5kg
Transport height	900±40mm
Board edge gap	2.5mm
Board height	15mm
Transport direction	L-R,R-L
Transport speed	max 1500mm/s, program control
Transport method	One stage
WIdth adjustment	automatic
I/O interface	SMEMA
PCB positioning (support method)	Magnetic pin/support block/manual up-down table
PCB clamping system	Patented over the top clamping
	Side clamping
	Adsorption function
Print snap-off	0-20mm
Print mode	one/twice
Print Speed	10-200mm/sec
Print Mode	One /Twice
Squeegee Type	Rubber /steel Squeegee Blade(Angle 45°/55°/60°)
Print pressure	0.5-10kg
Template fram size	470370mm~737737mm(20-40thickness)
Cleaning System	Droops of rain type cleaning system
	Reinforced vacuum absorption
	Dry, wet vacuum three modes
	Back and forth cleaning
CCD FOV	10x8mm
Fiducial mark types	Standard Fiducial mark shape
	Pad
	Hole
Camera system	Look up/down optics structure
	CCD digital camera
	Geometry pattern match

Machine Performance

Model	G9+
Repeat position accuracy	±12.5um@6,CPK≥2.0
Print accuracy	±18um@6,CPK≥2.0
Print cycle time	＜7.5 sec
Based on the third party test system(CTQ) verify the actual solder paste printing position repeat precision

Whole Machine Specification

Power supply	AC:220±10%,50/60HZ, 3.0KW
Air pressure	4~6 kgf/cm²
Air consumption	around 5L/min
Operating temperature	-20℃~+45℃
Operating humidity	30%~60%
Machine Dimensions(without tower light)	1172(L) x 1385(W) x 1530 (H)mm
Machine Weight	Approx: around 1000Kg

About Packaging

High Speed Stencil Cleaning New Multi-Function Interface High-End Solder Paste Printing Machine

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