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White Silkscreen 6 Layer PCB Black Solder Mask For Video Conference Device

Categories 6 Layer PCB
Brand Name: WITGAIN PCB
Model Number: PCB000389
Certification: UL
Place of Origin: China
MOQ: 1 pcs/lot
Price: negotiable
Payment Terms: T/T
Supply Ability: 100k pcs/month
Delivery Time: 20 days
Packaging Details: Vacuum bubble bag packaging
No of layers:: 6 Layer
Material:: FR4 TG>150
Place of Origin:: ShenZhen
Solder mask colour:: Black
Surface technics:: ENIG 1U'
Min Lind Space&Width:: 4/4 mil
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White Silkscreen 6 Layer PCB Black Solder Mask For Video Conference Device

6 Layer PCB Black Solder Mask White Silkscreen Used In Video Conference Devices


Printed Circuit Board Features:


1 6 Layer printed circuit board used in video conference devices.

2 FR4 substrate material, tg 150 degree.

3 Black solder mask and white silkscreen.

4 ENIG, gold thickness 1U'

5 Finished pcb thickness 1.0mm.

6 35 um copper thcikness on each layer.

7 PCB file or gerber file should be offered by customer.

8 Customized printed circuit board.


Packing Specifications:


1 One vacuum pcb package should not be over 25 panels based on panel size.

2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.

3 The pcb package must be suitable to ensure effective vacuum sealing.

4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.

5 Humidity indicator card target less than 10%.


S1150G Data Sheet:


S1150G
ItemsMethodConditionUnitTypical Value
TgIPC-TM-650 2.4.25DSC155
TdIPC-TM-650 2.4.24.65% wt. loss380
CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃36
After Tgppm/℃220
50-260℃%2.8
T260IPC-TM-650 2.4.24.1TMAmin>60
T288IPC-TM-650 2.4.24.1TMAmin30
Thermal StressIPC-TM-650 2.4.13.1288℃, solder dip--pass
Volume ResistivityIPC-TM-650 2.5.17.1After moisture resistanceMΩ.cm6.4 x 107
E-24/125MΩ.cm5.3 x 106
Surface ResistivityIPC-TM-650 2.5.17.1After moisture resistance4.8 x 107
E-24/1252.8 x 106
Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-4/23s140
Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-4/23kV45+kV NB
Dissipation Constant (Dk)IPC-TM-650 2.5.5.91MHz--4.8
IEC 61189-2-72110GHz--
Dissipation Factor (Df)IPC-TM-650 2.5.5.91MHz--0.01
IEC 61189-2-72110GHz--
Peel Strength (1Oz HTE copper foil)IPC-TM-650 2.4.8AN/mm
After thermal Stress 288℃,10sN/mm1.4
125℃N/mm1.3
Flexural StrengthLWIPC-TM-650 2.4.4AMPa600
CWIPC-TM-650 2.4.4AMPa450
Water AbsorptionIPC-TM-650 2.6.2.1E-1/105+D-24/23%0.1
CTIIEC60112ARatingPLC 0
FlammabilityUL94C-48/23/50RatingV-0
E-24/125RatingV-0

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